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Mingyu Li

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Published work

13 published item(s)

preprint2026arXiv

A Case for Agentic Tuning: From Documentation to Action in PostgreSQL

Documentation has long guided computer system tuning by distilling expert knowledge into per-parameter recommendations. Yet such guides capture only what experts conclude, discarding how they reason. This fundamental gap manifests in three concrete deficiencies: documentation grows stale as software evolves, fails under heterogeneous workloads, and ignores inter-parameter dependencies. We propose shifting from static documentation to dynamic action for system tuning. We introduce PerfEvolve, which translates expert tuning methodologies into executable skills that equip LLM-based agents to perform version-consistency verification, workload-specific profiling, and multi-parameter joint optimization. Evaluated on PostgreSQL under TPC-C and TPC-H benchmarks, PerfEvolve outperforms state-of-the-art documentation-driven tuning baselines by up to 35.2%. The tool is available at https://github.com/ISCAS-OSLab/PerfEvolve.

preprint2026arXiv

Can AI Dream of Unseen Galaxies? Conditional Diffusion Model for Galaxy Morphology Augmentation

Observational astronomy relies on visual feature identification to detect critical astrophysical phenomena. While machine learning (ML) increasingly automates this process, models often struggle with generalization in large-scale surveys due to the limited representativeness of labeled datasets, whether from simulations or human annotation, a challenge pronounced for rare yet scientifically valuable objects. To address this, we propose a conditional diffusion model to synthesize realistic galaxy images for augmenting ML training data (hereafter GalaxySD). Leveraging the Galaxy Zoo 2 dataset which contains visual feature, galaxy image pairs from volunteer annotation, we demonstrate that GalaxySD generates diverse, high-fidelity galaxy images that closely adhere to the specified morphological feature conditions. Moreover, this model enables generative extrapolation to project well-annotated data into unseen domains and advancing rare object detection. Integrating synthesized images into ML pipelines improves performance in standard morphology classification, boosting completeness and purity by up to 30% across key metrics. For rare object detection, using early-type galaxies with prominent dust lane features (~0.1% in GZ2 dataset) as a test case, our approach doubled the number of detected instances, from 352 to 872, compared to previous studies based on visual inspection. This study highlights the power of generative models to bridge gaps between scarce labeled data and the vast, uncharted parameter space of observational astronomy and sheds insight for future astrophysical foundation model developments. Our project homepage is available at https://galaxysd-webpage.streamlit.app/.

preprint2025arXiv

Characterization of mini-CryoCube detectors from the Ricochet experiment commissioning at the Institut Laue-Langevin

The Ricochet experiment aims to measure the coherent elastic neutrino-nucleus scattering process from antineutrinos emitted by a research nuclear reactor operated by the Institut Laue-Langevin (Grenoble, France). This article presents a description of the Ricochet experimental installation and the detector performance achieved during its commissioning with a mini-CryoCube module consisting of three 42-gram germanium cryogenic calorimeters. The baseline resolutions and background levels are reported both during reactor-on and reactor-off periods, and as noise mitigation techniques were improved. A baseline resolution of 40 eV electron equivalent was achieved for the ionization channel after setup improvements, and the phonon channel resolutions ranged from 50 to 80 eV of total phonon energy. In the energy region from 2 to 7 keV, a nuclear recoil rate of 15(2) events/(kg day keV) is measured during the reactor-off period selecting events in coincidence with muon veto signals. This rate is in agreement with the cosmogenic neutron rate calculated from GEANT4 simulations. After the rejection of events in coincidence with signals in the muon veto detectors, a combined 90% C.L. limit on the nuclear recoil background of < 9 events/(kg day keV) is obtained in that energy region during the reactor-on period, which is compatible with our GEANT4 model calculation corresponding to a total rate of 5 events/(kg day keV). The sensitivity of this analysis was however found to be limited by a surface event contamination which is currently being addressed by the Ricochet Collaboration with upgraded detectors.

preprint2023arXiv

MAMMOTH-Subaru III. Ly$α$ Halo Extended to $\sim200$ kpc Identified by Stacking $\sim 3300$ Ly$α$ Emitters at $z=2.2-2.3$

In this paper, we present a Ly$α$ halo extended to $\sim200$ kpc identified by stacking $\sim 3300$ Ly$α$ emitters at $z=2.2-2.3$. We carry out imaging observations and data reduction with Subaru/Hyper Suprime-Cam (HSC). Our total survey area is $\sim12$ deg$^2$ and imaging depths are $25.5-27.0$ mag. Using the imaging data, we select 1,240 and 2,101 LAE candidates at $z=2.2$ and 2.3, respectively. We carry out spectroscopic observations of our LAE candidates and data reduction with Magellan/IMACS to estimate the contamination rate of our LAE candidates. We find that the contamination rate of our sample is low (8%). We stack our LAE candidates with a median stacking method to identify the Ly$α$ halo at $z=2$. We show that the Ly$α$ halo is extended to $\sim200$ kpc at a surface brightness level of $10^{-20}$ erg s$^{-1}$ cm$^{-2}$ arcsec$^{-2}$. Comparing to previous studies, our Ly$α$ halo is more extended at radii of $\sim25-100$ kpc, which is not likely caused by the contamination in our sample but by different redshifts and fields instead. To investigate how central galaxies affect surrounding LAHs, we divide our LAEs into subsamples based on the Ly$α$ luminosity ($L_{\rm Lyα}$), rest-frame Ly$α$ equivalent width (EW$_0$), and UV magnitude (M$_{\rm uv}$). We stack the subsamples and find that higher $L_{\rm Lyα}$, lower EW$_0$, and brighter M$_{\rm uv}$ cause more extended halos. Our results suggest that more massive LAEs generally have more extended Ly$α$ halos.

preprint2023arXiv

MAMMOTH-Subaru V. Effects of Cosmic Variance on Ly$α$ Luminosity Functions at $z=2.2-2.3$

Cosmic variance introduces significant uncertainties into galaxy number density properties when surveying the high-z Universe with a small volume, such uncertainties produce the field-to-field variance of galaxy number $σ_{g}$ in observational astronomy. This uncertainty significantly affects the Luminosity Functions (LF) measurement of Lya Emitters (LAEs). For most previous Lya LF studies, $σ_{g}$ is often adopted from predictions by cosmological simulations, but barely confirmed by observations. Measuring cosmic variance requires a huge sample over a large volume, exceeding the capabilities of most astronomical instruments. In this study, we demonstrate an observational approach for measuring the cosmic variance contribution for $z\approx2.2$ Lya LFs. The LAE candidates are observed using narrowband and broadband of the Subaru/Hyper Suprime-Cam (HSC), with 8 independent fields, making the total survey area $\simeq11.62$deg$^2$ and a comoving volume of $\simeq8.71\times10^6$Mpc$^3$. These eight fields are selected using the project of MAMMOTH. We report a best-fit Schechter function with parameters $α=-1.75$ (fixed), $L_{Lyα}^{*}=5.18_{-0.40}^{+0.43} \times 10^{42}$erg s$^{-1}$ and $ϕ_{Lya}^{*}=4.87_{-0.55}^{+0.54}\times10^{-4}$Mpc$^{-3}$ for the overall Lya LFs. After clipping out the regions that can bias the cosmic variance measurements, we calculate $σ_{g}$, by sampling LAEs within multiple pointings assigned on the field image. We investigate the relation between $σ_{g}$ and survey volume $V$, and fit a simple power law: $σ_g=k\times(\frac{V_{\rm eff}}{10^5 {\rm Mpc}^3})^β$. We find best-fit values of $-1.209_{-0.106}^{+0.106}$ for $β$ and $0.986_{-0.100}^{+0.108}$ for k. We compare our measurements with predictions from simulations and find that the cosmic variance of LAEs might be larger than that of general star-forming galaxies.

preprint2022arXiv

The Identification of a Dusty Multiarm Spiral Galaxy at $z=3.06$ with JWST and ALMA

Spiral arms serve crucial purposes in star formation and galaxy evolution. In this paper, we report the identification of A2744-DSG-$z3$, a dusty, multiarm spiral galaxy at $z=3.059$ using the James Webb Space Telescope (JWST) NIRISS imaging and grism spectroscopy. A2744-DSG-$z3$ was discovered as a gravitationally lensed sub-millimeter galaxy with ALMA. This is the most distant stellar spiral structure seen thus far, consistent with cosmological simulations which suggest $z\approx3$ as the epoch when spirals emerge. Thanks to the gravitational lensing and excellent spatial resolution of JWST, the spiral arms are resolved with a spatial resolution of $\approx290$\,pc. Based on SED fitting, the spiral galaxy has a de-lensed star formation rate of $85\pm30 \ M_{\odot}$ yr$^{-1}$, and a stellar mass of $\approx10^{10.6}\ M_{\odot}$, indicating that A2744-DSG-$z3$ is a main-sequence galaxy. After fitting the spiral arms, we find a stellar effective radius ($R_{e, \rm{star}}$) of $5.0\pm1.5$ kpc. Combing with ALMA measurements, we find that the effective radii ratio between dust and stars is $\approx0.4$, similar to {those} of massive SFGs at $z\sim2$, indicating a compact dusty core in A2744-DSG-$z3$. Moreover, this galaxy appears to be living in a group environment: including A2744-DSG-$z3$, at least three galaxies at $z=3.05 - 3.06$ {are} spectroscopically confirmed by JWST/NIRISS and ALMA, residing within a lensing-corrected projected scale of $\approx 70$ kpc. This, along with the asymmetric brightness profile, further suggests that the spiral arms may be triggered by minor merger events at $z\gtrsim3$.

preprint2020arXiv

Highly flexible electromagnetic interference shielding films based on ultrathin Ni/Ag composites on paper substrates

Highly flexible electromagnetic interference (EMI) shielding material with excellent shielding performance is of great significance to practical applications in next-generation flexible devices. However, most EMI materials suffer from insufficient flexibility and complicated preparation methods. In this study, we propose a new scheme to fabricate a magnetic Ni particle/Ag matrix composite ultrathin film on a paper surface. For a ~2 micro meter thick film on paper, the EMI shielding effectiveness (SE) was found to be 46.2 dB at 8.1 GHz after bending 200,000 times over a radius of ~2 mm. The sheet resistance (Rsq) remained lower than 2.30 Ohm after bending 200,000 times. Contrary to the change in Rsq, the EMI SE of the film generally increased as the weight ratio of Ag to Ni increased, in accordance with the principle that EMI SE is positively related with an increase in electrical conductivity. Desirable EMI shielding ability, ultrahigh flexibility, and simple processing provide this material with excellent application prospects.

preprint2018arXiv

Aurora: Providing Trusted System Services for Enclaves On an Untrusted System

Intel SGX provisions shielded executions for security-sensitive computation, but lacks support for trusted system services (TSS), such as clock, network and filesystem. This makes \textit{enclaves} vulnerable to Iago attacks~\cite{DBLP:conf/asplos/CheckowayS13} in the face of a powerful malicious system. To mitigate this problem, we present Aurora, a novel architecture that provides TSSes via a secure channel between enclaves and devices on top of an untrusted system, and implement two types of TSSes, i.e. clock and end-to-end network. We evaluate our solution by porting SQLite and OpenSSL into Aurora, experimental results show that SQLite benefits from a \textit{microsecond} accuracy trusted clock and OpenSSL gains end-to-end secure network with about 1ms overhead.

preprint2016arXiv

Routability in 3D IC Design: Monolithic 3D vs. Skybridge 3D CMOS

Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer Via alleviate some of these challenges, they follow a similar layout and routing mindset as 2D CMOS. This is insufficient to address routing requirements in high-density 3D ICs and even causes severe routing congestion at large-scale designs, limiting their benefits and scalability. Skybridge is a recently proposed fine-grained 3D IC fabric relying on vertical nanowires that presents a paradigm shift for scaling, while addressing associated 3D connectivity and manufacturability challenges. Skybridge's core fabric components enable a new 3D IC design approach with vertically-composed logic gates, and provide a greater degree of routing flexibility compared to conventional 2D and 3D ICs leading to much larger benefits and future scalability. In this paper, we present a methodology using relevant metrics to evaluate and quantify the benefits of Skybridge vs. state-of-the-art transistor-level monolithic 3D IC (T-MI) and 2D in terms of routability and its impact on large-scale circuits. This is enabled by a new device-to-system design flow with commercial CAD tools that we developed for large-scale Skybridge IC designs in 16nm node. Evaluation for standard benchmark circuits shows that Skybridge yields up to 1.6x lower routing demand against T-MI with no routing congestion (routing demand to resource ratio < 1) at all metal layers. This 3D routability in conjunction with compact vertical gate design in Skybridge translate into benefits of up to 3x lower power and 11x higher density over 2D CMOS, while TLM-3DIC approach only has up to 22% power saving and 2x density improvement over 2D CMOS.

preprint2016arXiv

Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology

Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging connectivity, routing and layer alignment between layers when connected in 3D, with a routing access that can be even worse than 2D CMOS, which fundamentally limits their potential. To fully exploit the opportunities in the third dimension, we propose Skybridge-3D-CMOS (S3DC), a fine-grained 3D integration approach that is directly composed in 3D, utilizing the vertical dimension vs. using a layer-by-layer assembly mindset. S3DC uses a novel wafer fabric creation with direct 3D design and connectivity in the vertical dimension. It builds on a uniform vertical nanowire template that is processed as a single wafer; it incorporates specifically architected structures for realizing devices, circuits, and heat management directly in 3D. Novel 3D interconnect concepts, including within the silicon layers, enable significantly improved routing flexibility in all three dimensions and a high-density 3D design paradigm overall. Intrinsic components for fabric-level 3D heat management are introduced. Extensive bottom-up simulations and experiments have been presented to validate the key fabric-enabling concepts. Evaluation results indicate up to 40x density and 10x performance-per-watt benefits against conventional 16-nm CMOS for the circuits studied; benefits are also at least an order of magnitude beyond what was shown to be possible with other 3D directions.

preprint2015arXiv

Manufacturing Pathway and Experimental Demonstration for Nanoscale Fine-Grained 3-D Integrated Circuit Fabric

At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to continue scaling, however, intrinsic requirements of CMOS are not compatible for fine-grained 3D integration. We proposed a truly fine-grained 3D integrated circuit fabric called Skybridge that solves nanoscale challenges and achieves orders of magnitude benefits over CMOS. In Skybridge, device, circuit, connectivity, thermal management and manufacturing issues are addressed in an integrated 3D compatible manner. At the core of Skybridge assembly are uniform vertical nanowires, which are functionalized with architected features for fabric integration. All active components are created primarily using sequential material deposition steps on these nanowires. Lithography and doping are performed prior to any functionalization and their precision requirements are significantly reduced. This paper introduces Skybridge manufacturing pathway that is developed based on extensive process, device simulations and experimental metrology, and uses established processes. Experimental demonstrations of key process steps are also shown.

preprint2015arXiv

Multi-Objective Optimization of a Port-of-Entry Inspection Policy

At the port-of-entry containers are inspected through a specific sequence of sensor stations to detect the presence of nuclear materials, biological and chemical agents, and other illegal cargo. The inspection policy, which includes the sequence in which sensors are applied and the threshold levels used at the inspection stations, affects the probability of misclassifying a container as well as the cost and time spent in inspection. In this paper we consider a system operating with a Boolean decision function combining station results and present a multi-objective optimization approach to determine the optimal sensor arrangement and threshold levels while considering cost and time. The total cost includes cost incurred by misclassification errors and the total expected cost of inspection, while the time represents the total expected time a container spends in the inspection system. An example which applies the approach in a theoretical inspection system is presented.

preprint2014arXiv

Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are reaching their fundamental limits and interconnection bottleneck is dominating IC operational power and performance. Migrating to 3-D, as a way to advance scaling, has eluded us due to inherent customization and manufacturing requirements in CMOS that are incompatible with 3-D organization. Partial attempts with die-die and layer-layer stacking have their own limitations. We propose a 3-D IC fabric technology, Skybridge[TM], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge's core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance per watt benefits, and 10X reduction in interconnect lengths vs. scaled 16-nm CMOS. Fabric-level heat extraction features are shown to successfully manage IC thermal profiles in 3-D. Skybridge can provide continuous scaling of integrated circuits beyond CMOS in the 21st century.