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Researcher profile

Zhifeng Huang

Zhifeng Huang contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
cond-mat.mtrl-scicond-mat.mes-hallRobotics

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Published work

3 published item(s)

preprint2021arXiv

Design of a Flying Humanoid Robot Based on Thrust Vector Control

Achieving short-distance flight helps improve the efficiency of humanoid robots moving in complex environments (e.g., crossing large obstacles or reaching high places) for rapid emergency missions. This study proposes a design of a flying humanoid robot named Jet-HR2. The robot has 10 joints driven by brushless motors and harmonic drives for locomotion. To overcome the challenge of the stable-attitude takeoff in small thrust-to-weight conditions, the robot was designed based on the concept of thrust vectoring. The propulsion system consists of four ducted fans, that is, two fixed on the waist of the robot and the other two mounted on the feet, for thrust vector control. The thrust vector is controlled by adjusting the attitude of the foot during the flight. A simplified model and control strategies are proposed to solve the problem of attitude instability caused by mass errors and joint position errors during takeoff. The experimental results show that the robot's spin and dive behaviors during takeoff were effectively suppressed by controlling the thrust vector of the ducted fan on the foot. The robot successfully achieved takeoff at a thrust-to-weight ratio of 1.17 (17 kg / 20 kg) and maintained a stable attitude, reaching a takeoff height of over 1000 mm.

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preprint2020arXiv

Combined effects of nonmetallic impurities and planned metallic dopants on grain boundary energy and strength

Most research on nanocrystalline alloys has been focused on planned doping of metals with other metallic elements, but nonmetallic impurities are also prevalent in the real world. In this work, we report on the combined effects of metallic dopants and nonmetallic impurities on grain boundary energy and strength using first-principles calculations, with a $Σ$5 (310) grain boundary in Cu chosen as a model system. We find a clear correlation between the grain boundary energy and the change in excess free volume of doped grain boundaries. A combination of a larger substitutional dopant and an interstitial impurity can fill the excess free volume more efficiently and further reduce the grain boundary energy. We also find that the strengthening effects of dopants and impurities are dominated by the electronic interactions between the host Cu atoms and the two types of dopant elements. For example, the significant competing effects of metal dopants such as Zr, Nb, and Mo with impurities on the grain boundary strength are uncovered from the density of states of the d electrons. As a whole, this work deepens the field's understanding of the interaction between metallic dopants and nonmetallic impurities on grain boundary properties, providing a guide for improving the thermal stability of materials while avoiding embrittling effects.

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preprint2020arXiv

Uncovering the influence of common nonmetal impurities on the stability and strength of a $Σ$5 (310) grain boundary in Cu

Impurities are often driven to segregate to grain boundaries, which can significantly alter a material's thermal stability and mechanical behavior. To provide a comprehensive picture of this issue, the influence of a wide variety of common nonmetal impurities (H, B, C, N, O, Si, P and S) incorporated during service or materials processing are studied using first-principles simulations, with a focus on identifying changes to the energetics and mechanical strength of a Cu $Σ$5 (310) grain boundary. Changes to the grain boundary energy are found to be closely correlated with the covalent radii of the impurities and the volumetric deformations of polyhedra at the interface. The strengthening energies of each impurity are evaluated as a function of covalent radius and electronegativity, followed by first-principles-based tensile tests on selected impurities. The strengthening of a B-doped grain boundary comes from an enhancement of the charge density among the adjacent Cu atoms, which improves the connection between the two grains. Alternatively, the detrimental effect of O results from the reduction of charge density between the Cu atoms. This work deepens the understanding of the possible beneficial and harmful effects of impurities on grain boundaries, providing a guide for materials processing studies.

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