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Researcher profile

Timothy J. Rupert

Timothy J. Rupert contributes to research discovery and scholarly infrastructure.

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cond-mat.mtrl-scicond-mat.mes-hall

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Published work

10 published item(s)

preprint2022arXiv

Growth and structural transitions of core-shell nanorods in nanocrystalline Al-Ni-Y

Unique nanorod precipitates with a core-shell structure are found to nucleate from the grain boundaries of a bulk nanocrystalline Al-Ni-Y alloy fabricated via powder consolidation, contributing significantly to stabilization and strengthening. The local structure, chemistry, and evolution of these features during annealing is reported here. In the as-consolidated state, the nanorods can be either structurally ordered or disordered, yet a consistent chemical patterning is found where the core is primarily Al plus C while the shell is enriched with Y. As annealing time increases, more nanorods transform to an ordered structure as they coarsen while the core composition remains unchanged. In contrast, the shell chemistry transitions from Y-rich to Ni-rich with longer annealing treatments, most likely due to the different diffusivities of Y and Ni in Al. Moreover, a spatial and chemical correlation between the nanorods and amorphous complexions is observed, suggesting that these complexions serve as preferential nucleation sites.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

Intermetallic particle heterogeneity controls shear localization in high-strength nanostructured Al alloys

The mechanical behavior of two nanocrystalline Al alloys, Al-Mg-Y and Al-Fe-Y, is investigated with in-situ micropillar compression testing. Both alloys were strengthened by a hierarchical microstructure including grain boundary segregation, nanometer-thick amorphous complexions, carbide nanorod precipitates with sizes of a few nanometers, and submicron-scale intermetallic particles. The maximum yield strength of the Al-Mg-Y system is measured to be 950 MPa, exceeding that of the Al-Fe-Y system (680 MPa), primarily due to a combination of more carbide nanorods and more amorphous complexions. Both alloys exhibited yield strengths much higher than those of commercial Al alloys, and therefore have great potential for structural applications. However, some micropillar specimens were observed to plastically soften through shear banding. Post-mortem investigation revealed that intermetallic-free deformation pathways of a few micrometers in length were responsible for this failure. Further characterization showed significant grain growth within the shear band. The coarsened grains maintained the same orientation with each other, pointing to grain boundary mechanisms for plastic flow, specifically grain rotation and/or grain boundary migration. The presence of intermetallic particles makes it difficult for both matrix and intermetallic grains to rotate into the same orientation due to the different lattice parameters and slip systems. Therefore, we are able to conclude that a uniform distribution of intermetallic particles with an average spacing less than the percolation length of shear localization can effectively prevent the maturation of shear bands, offering a design strategy for high-strength nanocrystalline Al alloys with both high strength and stable plastic flow.

0 citations0 reviewsNo code linkedOpen access
preprint2021arXiv

Multi-principal element grain boundaries: Stabilizing nanocrystalline grains with thick amorphous complexions

Amorphous complexions have recently been demonstrated to simultaneously enhance the ductility and stability of certain nanocrystalline alloys. In this study, three quinary alloys (Cu-Zr-Hf-Mo-Nb, Cu-Zr-Hf-Nb-Ti, and Cu-Zr-Hf-Mo-W) are studied to test the hypothesis that increasing the chemical complexity of the grain boundaries will result in thicker amorphous complexions and further stabilize a nanocrystalline microstructure. Significant boundary segregation of Zr, Nb, and Ti is observed in the Cu-Zr-Hf-Nb-Ti alloy, which creates a quaternary interfacial composition that limits average grain size to 63 nm even after 1 week at ~97% of the melting temperature. This high level of thermal stability is attributed to the complex grain boundary chemistry and amorphous structure resulting from multi-component segregation. High resolution transmission electron microscopy reveals that the increased chemical complexity of the grain boundary region in the Cu-Zr-Hf-Nb-Ti alloy results in an average amorphous complexion thickness of 2.44 nm, approximately 44% and 32% thicker than amorphous complexions previously observed in Cu-Zr and Cu-Zr-Hf alloys.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Combined effects of nonmetallic impurities and planned metallic dopants on grain boundary energy and strength

Most research on nanocrystalline alloys has been focused on planned doping of metals with other metallic elements, but nonmetallic impurities are also prevalent in the real world. In this work, we report on the combined effects of metallic dopants and nonmetallic impurities on grain boundary energy and strength using first-principles calculations, with a $Σ$5 (310) grain boundary in Cu chosen as a model system. We find a clear correlation between the grain boundary energy and the change in excess free volume of doped grain boundaries. A combination of a larger substitutional dopant and an interstitial impurity can fill the excess free volume more efficiently and further reduce the grain boundary energy. We also find that the strengthening effects of dopants and impurities are dominated by the electronic interactions between the host Cu atoms and the two types of dopant elements. For example, the significant competing effects of metal dopants such as Zr, Nb, and Mo with impurities on the grain boundary strength are uncovered from the density of states of the d electrons. As a whole, this work deepens the field's understanding of the interaction between metallic dopants and nonmetallic impurities on grain boundary properties, providing a guide for improving the thermal stability of materials while avoiding embrittling effects.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Disconnection-mediated twin embryo growth in Mg

While deformation twinning in hexagonal close-packed metals has been widely studied due to its substantial impact on mechanical properties, an understanding of the detailed atomic processes associated with twin embryo growth is still lacking. Conducting molecular dynamics simulations on Mg, we show that the propagation of twinning disconnections emitted by basal-prismatic interfaces controls the twin boundary motion and is the rate-limiting mechanism during the initial growth of the twin embryo. The time needed for disconnection propagation is related to the distance between the twin tips, with widely spaced twin tips requiring more time for a unit twin boundary migration event to be completed. Thus, a phenomenological model, which unifies the two processes of disconnection and twin tip propagation, is proposed here to provide a quantitative analysis of twin embryo growth. The model fits the simulation data well, with two key parameters (twin tip velocity and twinning disconnection velocity) being extracted. In addition, a linear relationship between the ratio of twinning disconnection velocity to twin tip velocity and the applied shear stress is observed. Using an example of twin growth in a nanoscale single crystal from the recent literature, we find that our molecular dynamics simulations and analytical model are in good agreement with experimental data.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Emergence of directionally-anisotropic mobility in a faceted $Σ$11 <110> tilt grain boundary in Cu

Faceted grain boundaries, where grain boundary area is increased in the name of producing low-energy segments, can exhibit new and unexpected migration trends. For example, several faceted $Σ$3 boundaries have demonstrated anti-thermal and thermally damped mobility. $Σ$11 <110> tilt boundaries represent another promising but relatively unexplored set of interfaces, with a (113) low-energy plane that can lead to faceting. In this study, molecular dynamics simulations are used to study grain boundary migration of an asymmetric $Σ$11 <110> grain boundary in two face centered cubic metals. Mobility of this boundary in Cu is strongly dependent on the direction of the applied driving force. The mobility anisotropy generally becomes smaller, but does not disappear completely, as temperature is increased. In contrast, the same boundary in Al demonstrates similar mobilities in either direction, illustrating that the anisotropic mobility phenomenon is material-dependent. Finally, relationships between stacking fault energy, facet junction defect content, and boundary crystallography are uncovered that may inform future studies of faceted grain boundaries.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

In situ mechanical testing of an Al matrix composite to investigate compressive plasticity and failure on multiple length scales

SiC particle-reinforced Al matrix composites exhibit high strength, high wear resistance, and excellent high-temperature performance, but can also have low plasticity and fracture toughness, which limits their use in structural applications. This study investigates the plasticity and failure of such a composite on multiple length scales, from strain localization through a complex microstructure to the debonding of individual microparticles from the matrix. Three microscale pillars containing microstructures with different complexities and sizes/volume fraction of SiC particles were used to study the effect of these features on deformation. For the matrix, nanoscale intermetallic precipitates within the Al grains contribute most to the strengthening effect, and the Al grain boundaries are shown to be effective obstacles for preventing strain localization by dominant shear bands and, therefore, catastrophic failure. When shear localization occurs, SiC particles can then debond from the matrix if the shear band and interface are aligned. To investigate whether the interface is a weak point during catastrophic failure, a number of SiC particles were separated from the matrix with direct debonding tests, which yield an interface strength that is much higher than the critical resolved shear stress for a pillar exhibiting both shear localization and interface debonding. Therefore, the matrix-particle interface is ruled out as a possible weak point, and instead shear localization is identified as the mechanism that can drive subsequent interface debonding.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Nanocrystalline grain boundary engineering: Increasing $Σ$3 boundary fraction in pure Ni with thermomechanical treatments

Grain boundary networks should play a dominant role in determining the mechanical properties of nanocrystalline metals. However, these networks are difficult to characterize and their response to deformation is incompletely understood. In this work, we study the grain boundary network of nanocrystalline Ni and explore whether it can be modified by plastic deformation. Mechanical cycling at room temperature did not lead to structural evolution, but elevated temperature cycling did alter the grain boundary network. In addition to mechanically-driven grain growth, mechanical cycling at 100 $°$C led to a 48% increase in $Σ$3 boundaries, determined with transmission Kikuchi diffraction. The extent of boundary modification was a function of the number of applied loading cycles and the testing temperature, with more cycles at higher temperatures leading to more special grain boundaries. The results presented here suggest a path to grain boundary engineering in nanocrystalline materials.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Solid-state dewetting instability in thermally-stable nanocrystalline binary alloys

Practical applications of nanocrystalline metallic thin films are often limited by instabilities. In addition to grain growth, the thin film itself can become unstable and collapse into islands through solid-state dewetting. Selective alloying can improve nanocrystalline stability, but the impact of this approach on dewetting is not clear. In this study, two alloys that exhibit nanocrystalline thermal stability as ball milled powders are evaluated as thin films. While both alloys demonstrated dewetting behavior following annealing, the severity decreased in more dilute compositions. Ultimately, a balance may be struck between nanocrystalline stability and thin film structural stability by tuning dopant concentration.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Uncovering the influence of common nonmetal impurities on the stability and strength of a $Σ$5 (310) grain boundary in Cu

Impurities are often driven to segregate to grain boundaries, which can significantly alter a material&#39;s thermal stability and mechanical behavior. To provide a comprehensive picture of this issue, the influence of a wide variety of common nonmetal impurities (H, B, C, N, O, Si, P and S) incorporated during service or materials processing are studied using first-principles simulations, with a focus on identifying changes to the energetics and mechanical strength of a Cu $Σ$5 (310) grain boundary. Changes to the grain boundary energy are found to be closely correlated with the covalent radii of the impurities and the volumetric deformations of polyhedra at the interface. The strengthening energies of each impurity are evaluated as a function of covalent radius and electronegativity, followed by first-principles-based tensile tests on selected impurities. The strengthening of a B-doped grain boundary comes from an enhancement of the charge density among the adjacent Cu atoms, which improves the connection between the two grains. Alternatively, the detrimental effect of O results from the reduction of charge density between the Cu atoms. This work deepens the understanding of the possible beneficial and harmful effects of impurities on grain boundaries, providing a guide for materials processing studies.

0 citations0 reviewsNo code linkedOpen access