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Vivek Goyal

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cond-mat.mes-hall cond-mat.mtrl-sci

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preprint2012arXiv

Graphene-on-Diamond Devices with Enhanced Current-Carrying Capacity: Carbon sp2-on-sp3 Technology

Graphene demonstrated potential for practical applications owing to its excellent electronic and thermal properties. Typical graphene field-effect transistors and interconnects built on conventional SiO2/Si substrates reveal the breakdown current density on the order of 1 uA/nm2 (i.e. 10^8 A/cm2) which is ~100\times larger than the fundamental limit for the metals but still smaller than the maximum achieved in carbon nanotubes. We show that by replacing SiO2 with synthetic diamond one can substantially increase the current-carrying capacity of graphene to as high as ~18 uA/nm2 even at ambient conditions. Our results indicate that graphene's current-induced breakdown is thermally activated. We also found that the current carrying capacity of graphene can be improved not only on the single-crystal diamond substrates but also on an inexpensive ultrananocrystalline diamond, which can be produced in a process compatible with a conventional Si technology. The latter was attributed to the decreased thermal resistance of the ultrananocrystalline diamond layer at elevated temperatures. The obtained results are important for graphene's applications in high-frequency transistors, interconnects, transparent electrodes and can lead to the new planar sp2-on-sp3 carbon-on-carbon technology.

preprint2012arXiv

Thermal Properties of the Hybrid Graphene-Metal Nano-Micro-Composites: Applications in Thermal Interface Materials

The authors report on synthesis and thermal properties of the electrically-conductive thermal interface materials with the hybrid graphene-metal particle fillers. The thermal conductivity of resulting composites was increased by ~500% in a temperature range from 300 K to 400 K at a small graphene loading fraction of 5-vol.-%. The unusually strong enhancement of thermal properties was attributed to the high intrinsic thermal conductivity of graphene, strong graphene coupling to matrix materials and the large range of the length-scale - from nanometers to micrometers - of the graphene and silver particle fillers. The obtained results are important for thermal management of advanced electronics and optoelectronics.

preprint2010arXiv

From Graphene to Bismuth Telluride: Mechanical Exfoliation of Quasi-2D Crystals for Applications in Thermoelectrics and Topological Insulators

Bismuth telluride (Bi2Te3) and its alloys are the best bulk thermoelectric materials known today. The stacked quasi-two-dimensional (2D) layers of Bi2Te3 were also identified as topological insulators. In this paper we describe a method for graphene-inspired exfoliation of crystalline bismuth telluride films with a thickness of a few atoms. The atomically thin films were suspended across trenches in Si/SiO2 substrates, and subjected to detail characterization. The presence of the van der Waals gaps allowed us to disassemble Bi2Te3 crystal into its quintuple building blocks - five mono-atomic sheets consisting of Te(1)-Bi-Te(2)-Bi-Te(1). By altering the thickness and sequence of atomic planes we were able to create designer non-stoichiometric quasi-2D crystalline films, change their composition and doping, as well as other properties. The exfoliated quintuples and ultra-thin films have low thermal conductivity, high electrical conductivity and enhanced thermoelectric properties. The obtained results pave the way for producing stacks of crystalline bismuth telluride quantum wells with the strong spatial confinement of charge carriers and acoustic phonons for thermoelectric devices. The developed technology for producing free-standing quasi-2D layers of Te(1)-Bi-Te(2)-Bi-Te(1) creates an impetus for investigation of the topological insulators and their possible practical applications.

preprint2010arXiv

Mechanically-Exfoliated Stacks of Thin Films of Bismuth Telluride Topological Insulators with Enhanced Thermoelectric Performance

We report on "graphene-like" mechanical exfoliation of single-crystal Bi2Te3 films and thermoelectric characterization of the stacks of such films. Thermal conductivity of the resulting "pseudo-superlattices" was measured by the "hot disk" and "laser flash" techniques. The room-temperature in-plane (cross-plane) thermal conductivity of the stacks decreases by a factor of ~2.4 (3.5) as compared to bulk. The thermal conductivity reduction with preserved electrical properties leads to strong increase in the thermoelectric figure of merit. It is suggested that the film thinning to few-quintuples and tuning of the Fermi level can help in achieving the topological-insulator surface transport regime with an extraordinary thermoelectric efficiency.

preprint2009arXiv

"Graphene-Like" Exfoliation of Atomically-Thin Bismuth Telluride Films

We report on graphene-like exfoliation of the large-area crystalline films and ribbons of bismuth telluride with the thicknesses of a few atoms. It is demonstrated that bismuth telluride, the most important material for thermoelectric industry, can be mechanically separated into its building blocks -[Te-Bi-Te-Bi-Te]- atomic five-folds with the thickness of ~1 nm and even further - to subunits with smaller thicknesses. The atomically-thin crystals can be structured into suspended crystalline ribbons providing quantum confinement in two dimensions. The quasi two-dimensional (2-D) crystals of bismuth telluride revealed high electrical conductivity. The proposed atomic-layer engineering of bismuth telluride opens up a principally new route for drastic enhancement of the thermoelectric figure of merit.