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Researcher profile

Shun Cao

Shun Cao contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
eess.SYSystems and ControlMachine Learningphysics.opticsApplicationsmath.OCphysics.app-phphysics.ins-detSocial and Information Networks

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Published work

7 published item(s)

preprint2020arXiv

Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology

In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fluid dynamic behaviour of molten solder paste. This capability is critical in SMT because inaccurate self-alignment causes defects such as overhanging, tombstoning, etc. while on the other side, it can enable components to be perfectly self-assembled on or near the desire position. The aim of this study is to develop a machine learning model that predicts the components movement during reflow in x and y-directions as well as rotation. Our study is composed of two steps: (1) experimental data are studied to reveal the relationships between self-alignment and various factors including component geometry, pad geometry, etc. (2) advanced machine learning prediction models are applied to predict the distance and the direction of components shift using support vector regression (SVR), neural network (NN), and random forest regression (RFR). As a result, RFR can predict components shift with the average fitness of 99%, 99%, and 96% and with average prediction error of 13.47 (um), 12.02 (um), and 1.52 (deg.) for component shift in x, y, and rotational directions, respectively. This enhancement provides the future capability of the parameters' optimization in the pick and placement machine to control the best placement location and minimize the intrinsic defects caused by the self-alignment.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Detecting Dynamic States of Temporal Networks Using Connection Series Tensors

Many temporal networks exhibit multiple system states, such as weekday and weekend patterns in social contact networks. The detection of such distinct states in temporal network data has recently been explored as it helps reveal underlying dynamical processes. A commonly used method is network aggregation over a time window, which aggregates a subsequence of multiple network snapshots into one static network. This method, however, necessarily discards temporal dynamics within the time window. Here we develop a new method for detecting dynamic states in temporal networks using information regarding the timeline of contacts between each pair of nodes. We apply a similarity measure informed by the techniques of processing time series and community detection to sequentially discompose a given temporal network into multiple dynamic states (including repeated ones). Experiments with empirical temporal network data demonstrated that our method outperformed the conventional approach using simple network aggregation in revealing interpretable system states. In addition, our method allows users to analyze hierarchical temporal structures and to uncover dynamic state at different spatial/temporal resolutions.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Enhancing single photon emission through quasi-bound states in the continuum of monolithic hexagonal boron nitride metasurface

A patterned structure of monolithic hexagonal boron nitride (hBN) on a glass substrate, which can enhance the emission of the embedded single photon emitters (SPEs), is useful for onchip single-photon sources of high-quality. Here, we design and demonstrate a monolithic hBN metasurface with quasi-bound states in the continuum mode at emission wavelength with ultrahigh Q values to enhance fluorescence emission of SPEs in hBN. Because of ultrahigh electric field enhancement inside the proposed hBN metasurface, an ultrahigh Purcell factor (3.3*10^4) is achieved. In addition, the Purcell factor can also be strongly enhanced in most part of the hBN structure, which makes the hBN metasurface suitable for e.g. monolithic quantum photonics.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

High-Temperature Ultra-Broad UV-MIR High-Efficiency Absorber Based on Double Ring-Shaped Titanium Nitride Resonators

An ultrabroad absorber based on double-ring-shaped titanium nitride (TiN) nanoresonators, which can work in high temperatures, is proposed and numerically studied. The absorber with some optimal parameters exhibits an averaged absorption of 94.6% in the range of 200 - 4000 nm (from ultraviolet to mid-infrared) and a band from 200 - 3518 nm having an absorption > 90%. We have demonstrated in detail the physical mechanisms of the ultra-broad absorption, including the dielectric lossy property of TiN material itself in shorter wavelengths and plasmonic resonances caused by the metallic property of TiN nano-resonators in longer wavelengths. In addition, the absorber shows polarization independent and wide-angle acceptance. Another absorber with double TiN nano-rings of different heights has flatter and higher absorption efficiency (more than 95% absorption) at 200-2860 nm waveband. These properties make the proposed absorbers based on TiN has great potentials in many applications, such as light trapping, photovoltaics, thermal emitters.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology

Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are permanently attached on PCB with the aim of reflow soldering process. During reflow process, once deposited solder pastes start melting, electronic components move in a direction that achieve their highest symmetry. This motion is known as self-alignment since can correct potential mounting misalignment. In this study, two noticeable machine learning algorithms, including support vector regression (SVR) and random forest regression (RFR) are proposed as a prediction technique to (1) diagnose the relation among component self-alignment, deposited solder paste status and placement machining parameters, (2) predict the final component position on PCB in x, y, and rotational directions before entering in the reflow process. Based on the prediction result, a non-linear optimization model (NLP) is developed to optimize placement parameters at initial stage. Resultantly, RFR outperforms in terms of prediction model fitness and error. The optimization model is run for 6 samples in which the minimum Euclidean distance from component position after reflow process from ideal position (i.e., the center of pads) is outlined as 25.57 (μm) regarding defined boundaries in model.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression

In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste with some fluid properties could slump and the unbalance between different sides of solder paste can lead to other forces on the components as well. Though the shifts are usually considered to be negligible and can be made up to some extent by the following self-alignment during the process of soldering reflow, it should be attracted attention as its importance for addressing the quality of the printed circuit board (PCB) in SMT. To minimize or control the component shifts, whose relationship with the characteristics of the solder paste (e.g., offset, volume) should be studied initially. In this paper, we design a comprehensive experiment and collect the data from a state-of-the-art SMT assembly line. Then we use support vector regression (SVR) model to predict the component shifts based on different situations of solder paste and placement settings. Also, two kernel functions, linear (SVR-Linear) and radial basis function (SVR-RBF), are employed. The achieved results indicate that the component shift in P&P process is significant, and the SVR model is highly qualified for the forecast of the component shifts. Particularly, the SVR-RBF model outperforms the SVR-Linear model considering the prediction error.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology

The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, because the shift is considered to be negligibly small and the following self-alignment effect in the solder paste reflow soldering process could also make it up. However, with the decreasing size of the electronic components and the increasing demand for the low defective rate of PCB, the component shift in P&P process is becoming more and more important in quality control of SMT industries. Though a few papers are related to the component shift in P&P process, there is no earlier research using the data from the real production line. In this paper, we study two basic and important issues: the behavior of the component shift in P&P process and the contributing factors to it. Several statistical methods are used to explore the behavior component shift based on the data from a complete state-of-the-art SMT assembly line. Main effects and regression analysis are implemented to pinpoint the contributing factors. In order to investigate the issues comprehensively, six types of electronic components and multiple potential factors are considered in this work, e.g., solder paste properties (position, volume, area, height), designed position of the component, placement pressure. The results indicate that component shift cannot be ignored. Also, the position of solder paste, designed position of component and component type are the top three most important factors to study the component shifts in P&P process.

0 citations0 reviewsNo code linkedOpen access