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Leonid Yavits

Leonid Yavits appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

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Hardware Architectureeess.SYEmerging TechnologiesPerformanceSystems and Control

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Published work

7 published item(s)

preprint2022arXiv

FiltPIM: In-Memory Filter for DNA Sequencing

Aligning the entire genome of an organism is a compute-intensive task. Pre-alignment filters substantially reduce computation complexity by filtering potential alignment locations. The base-count filter successfully removes over 68% of the potential locations through a histogram-based heuristic. This paper presents FiltPIM, an efficient design of the basecount filter that is based on memristive processing-in-memory. The in-memory design reduces CPU-to-memory data transfer and utilizes both intra-crossbar and inter-crossbar memristive stateful-logic parallelism. The reduction in data transfer and the efficient stateful-logic computation together improve filtering time by 100x compared to a CPU implementation of the filter.

0 citations0 reviewsNo code linkedOpen access
preprint2021arXiv

Hamming Distance Tolerant Content-Addressable Memory (HD-CAM) for Approximate Matching Applications

We propose a novel Hamming distance tolerant content-addressable memory (HD-CAM) for energy-efficient in memory approximate matching applications. HD-CAM implements approximate search using matchline charge redistribution rather than its rise or fall time, frequently employed in state of-the-art solutions. HD-CAM was designed in a 65 nm 1.2 V CMOS technology and evaluated through extensive Monte Carlo simulations. Our analysis shows that HD-CAM supports robust operation under significant process variations and changes in the design parameters, enabling a wide range of mismatch threshold (tolerable Hamming distance) levels and pattern lengths. HD-CAM was functionally evaluated for virus DNA classification, which makes HD-CAM suitable for hardware acceleration of genomic surveillance of viral outbreaks such as Covid-19 pandemics.

0 citations0 reviewsNo code linkedOpen access
preprint2016arXiv

Effect of Data Sharing on Private Cache Design in Chip Multiprocessors

In multithreaded applications with high degree of data sharing, the miss rate of private cache is shown to exhibit a compulsory miss component. It manifests because at least some of the shared data originates from other cores and can only be accessed in a shared cache. The compulsory component does not change with the private cache size, causing its miss rate to diminish slower as the cache size grows. As a result, the peak performance of a Chip Multiprocessor (CMP) for workloads with high degree of data sharing is achieved with a smaller private cache, compared to workloads with no data sharing. The CMP performance can be improved by reassigning some of the constrained area or power resource from private cache to core. Alternatively, the area or power budget of a CMP can be reduced without a performance hit.

0 citations0 reviewsNo code linkedOpen access
preprint2013arXiv

3D Cache Hierarchy Optimization

3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache hierarchy levels into 3D silicon layers and optimal allocation of area among cache hierarchy levels under constrained area and power budgets. The optimization framework is extended by incorporating the impact of multithreaded data sharing on the private cache miss rate. An analytical model for cache access time as a function of cache size and a number of 3D partitions is proposed and verified using CACTI simulation.

0 citations0 reviewsNo code linkedOpen access
preprint2013arXiv

Computer Architecture with Associative Processor Replacing Last Level Cache and SIMD Accelerator

This study presents a novel computer architecture where a last level cache and a SIMD accelerator are replaced by an Associative Processor. Associative Processor combines data storage and data processing and provides parallel computational capabilities and data memory at the same time. An analytic performance model of the new computer architecture is introduced. Comparative analysis supported by simulation shows that this novel architecture may outperform a conventional architecture comprising a SIMD coprocessor and a shared last level cache while consuming less power.

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preprint2013arXiv

The Effect of Communication and Synchronization on Amdahl Law in Multicore Systems

This work analyses the effects of sequential-to-parallel synchronization and inter-core communication on multicore performance, speedup and scaling. A modification of Amdahl law is formulated, to reflect the finding that parallel speedup is lower than originally predicted, due to these effects. In applications with high inter-core communication requirements, the workload should be executed on a small number of cores, and applications of high sequential-to-parallel synchronization requirements may better be executed by the sequential core, even when f, the Amdahl fraction of parallelization, is very close to 1. To improve the scalability and performance speedup of a multicore, it is as important to address the synchronization and connectivity intensities of parallel algorithms as their parallelization factor.

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preprint2013arXiv

Thermal analysis of 3D associative processor

Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits close to uniform thermal distribution with reduced hot spots. Additionally, AP may outperform SIMD processor when the data set size is sufficiently large, while dissipating less power. Comparative performance and thermal analysis supported by simulation confirm that AP might be preferable over SIMD for 3D implementation of large scale massively parallel processing engines combined with 3D DRAM integration.

0 citations0 reviewsNo code linkedOpen access