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Researcher profile

Amir Morad

Amir Morad contributes to research discovery and scholarly infrastructure.

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Published work

4 published item(s)

preprint2013arXiv

3D Cache Hierarchy Optimization

3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache hierarchy levels into 3D silicon layers and optimal allocation of area among cache hierarchy levels under constrained area and power budgets. The optimization framework is extended by incorporating the impact of multithreaded data sharing on the private cache miss rate. An analytical model for cache access time as a function of cache size and a number of 3D partitions is proposed and verified using CACTI simulation.

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preprint2013arXiv

Computer Architecture with Associative Processor Replacing Last Level Cache and SIMD Accelerator

This study presents a novel computer architecture where a last level cache and a SIMD accelerator are replaced by an Associative Processor. Associative Processor combines data storage and data processing and provides parallel computational capabilities and data memory at the same time. An analytic performance model of the new computer architecture is introduced. Comparative analysis supported by simulation shows that this novel architecture may outperform a conventional architecture comprising a SIMD coprocessor and a shared last level cache while consuming less power.

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preprint2013arXiv

The Effect of Communication and Synchronization on Amdahl Law in Multicore Systems

This work analyses the effects of sequential-to-parallel synchronization and inter-core communication on multicore performance, speedup and scaling. A modification of Amdahl law is formulated, to reflect the finding that parallel speedup is lower than originally predicted, due to these effects. In applications with high inter-core communication requirements, the workload should be executed on a small number of cores, and applications of high sequential-to-parallel synchronization requirements may better be executed by the sequential core, even when f, the Amdahl fraction of parallelization, is very close to 1. To improve the scalability and performance speedup of a multicore, it is as important to address the synchronization and connectivity intensities of parallel algorithms as their parallelization factor.

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preprint2013arXiv

Thermal analysis of 3D associative processor

Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits close to uniform thermal distribution with reduced hot spots. Additionally, AP may outperform SIMD processor when the data set size is sufficiently large, while dissipating less power. Comparative performance and thermal analysis supported by simulation confirm that AP might be preferable over SIMD for 3D implementation of large scale massively parallel processing engines combined with 3D DRAM integration.

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