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Researcher profile

Krishnendu Chakrabarty

Krishnendu Chakrabarty contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
Emerging TechnologiesHardware ArchitectureCryptography and SecurityNeural and Evolutionary Computing

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Published work

6 published item(s)

preprint2026arXiv

H3PIMAP: A Heterogeneity-Aware Multi-Objective DNN Mapping Framework on Electronic-Photonic Processing-in-Memory Architectures

The future of artificial intelligence (AI) acceleration demands a paradigm shift beyond the limitations of purely electronic or photonic architectures. Photonic analog computing delivers unmatched speed and parallelism but struggles with data movement, robustness, and precision, while electronic processing-in-memory (PIM) enables energy-efficient computing by co-locating storage and computation but suffers from endurance and reconfiguration constraints, limiting it to static weight mapping. Neither approach alone achieves the balance needed for adaptive, efficient AI. To break this impasse, we study a hybrid electronic-photonic-PIM computing architecture and introduce H3PIMAP, a heterogeneity-aware mapping framework that seamlessly orchestrates workloads across electronic and optical tiers. By optimizing workload partitioning through a two-stage multi-objective exploration method, H3PIMAP harnesses light speed for high-throughput operations and PIM efficiency for memory-bound tasks. In system-level evaluations, H3PIMAP delivers a 3.32x latency reduction across language and vision models and, on large language models, achieves 77.0% lower latency with 14.6% lower energy at matched quality, outperforming homogeneous and naive mapping strategies. This proposed framework lays the foundation for hybrid AI accelerators, bridging the gap between electronic and photonic computation for next-generation efficiency and scalability.

0 citations0 reviewsNo code linkedOpen access
preprint2025arXiv

STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration

Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight chiplet packing, this strategy creates thermal bottlenecks and intensifies coefficient of thermal expansion (CTE) mismatches, compromising long-term reliability. Addressing these challenges requires holistic consideration of thermal performance, mechanical stress, and interconnect efficiency. We introduce STAMP-2.5D, the first automated floorplanning methodology that simultaneously optimizes these critical factors. Our approach employs finite element analysis to simulate temperature distributions and stress profiles across chiplet configurations while minimizing interconnect wirelength. Experimental results demonstrate that our thermal structural aware automated floorplanning approach reduces overall stress by 11% while maintaining excellent thermal performance with a negligible 0.5% temperature increase and simultaneously reducing total wirelength by 11% compared to temperature-only optimization. Additionally, we conduct an exploratory study on the effects of temperature gradients on structural integrity, providing crucial insights for reliability-conscious chiplet design. STAMP-2.5D establishes a robust platform for navigating critical trade-offs in advanced semiconductor packaging.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

Don't CWEAT It: Toward CWE Analysis Techniques in Early Stages of Hardware Design

To help prevent hardware security vulnerabilities from propagating to later design stages where fixes are costly, it is crucial to identify security concerns as early as possible, such as in RTL designs. In this work, we investigate the practical implications and feasibility of producing a set of security-specific scanners that operate on Verilog source files. The scanners indicate parts of code that might contain one of a set of MITRE's common weakness enumerations (CWEs). We explore the CWE database to characterize the scope and attributes of the CWEs and identify those that are amenable to static analysis. We prototype scanners and evaluate them on 11 open source designs - 4 system-on-chips (SoC) and 7 processor cores - and explore the nature of identified weaknesses. Our analysis reported 53 potential weaknesses in the OpenPiton SoC used in Hack@DAC-21, 11 of which we confirmed as security concerns.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

LoCI: An Analysis of the Impact of Optical Loss and Crosstalk Noise in Integrated Silicon-Photonic Neural Networks

Compared to electronic accelerators, integrated silicon-photonic neural networks (SP-NNs) promise higher speed and energy efficiency for emerging artificial-intelligence applications. However, a hitherto overlooked problem in SP-NNs is that the underlying silicon photonic devices suffer from intrinsic optical loss and crosstalk noise, the impact of which accumulates as the network scales up. Leveraging precise device-level models, this paper presents the first comprehensive and systematic optical loss and crosstalk modeling framework for SP-NNs. For an SP-NN case study with two hidden layers and 1380 tunable parameters, we show a catastrophic 84% drop in inferencing accuracy due to optical loss and crosstalk noise.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

ReaLPrune: ReRAM Crossbar-aware Lottery Ticket Pruned CNNs

Training machine learning (ML) models at the edge (on-chip training on end user devices) can address many pressing challenges including data privacy/security, increase the accessibility of ML applications to different parts of the world by reducing the dependence on the communication fabric and the cloud infrastructure, and meet the real-time requirements of AR/VR applications. However, existing edge platforms do not have sufficient computing capabilities to support complex ML tasks such as training large CNNs. ReRAM-based architectures offer high-performance yet energy efficient computing platforms for on-chip CNN training/inferencing. However, ReRAM-based architectures are not scalable with the size of the CNN. Larger CNNs have more weights, which requires more ReRAM cells that cannot be integrated in a single chip. Moreover, training larger CNNs on-chip will require higher power, which cannot be afforded by these smaller devices. Pruning is an effective way to solve this problem. However, existing pruning techniques are either targeted for inferencing only, or they are not crossbar-aware. This leads to sub-optimal hardware savings and performance benefits for CNN training on ReRAM-based architectures. In this paper, we address this problem by proposing a novel crossbar-aware pruning strategy, referred as ReaLPrune, which can prune more than 90% of CNN weights. The pruned model can be trained from scratch without any accuracy loss. Experimental results indicate that ReaLPrune reduces hardware requirements by 77.2% and accelerates CNN training by ~20X compared to unpruned CNNs. ReaLPrune also outperforms other crossbar-aware pruning techniques in terms of both performance and hardware savings. In addition, ReaLPrune is equally effective for diverse datasets and more complex CNNs

0 citations0 reviewsNo code linkedOpen access
preprint2021arXiv

ReGraphX: NoC-enabled 3D Heterogeneous ReRAM Architecture for Training Graph Neural Networks

Graph Neural Network (GNN) is a variant of Deep Neural Networks (DNNs) operating on graphs. However, GNNs are more complex compared to traditional DNNs as they simultaneously exhibit features of both DNN and graph applications. As a result, architectures specifically optimized for either DNNs or graph applications are not suited for GNN training. In this work, we propose a 3D heterogeneous manycore architecture for on-chip GNN training to address this problem. The proposed architecture, ReGraphX, involves heterogeneous ReRAM crossbars to fulfill the disparate requirements of both DNN and graph computations simultaneously. The ReRAM-based architecture is complemented with a multicast-enabled 3D NoC to improve the overall achievable performance. We demonstrate that ReGraphX outperforms conventional GPUs by up to 3.5X (on an average 3X) in terms of execution time, while reducing energy consumption by as much as 11X.

0 citations0 reviewsNo code linkedOpen access