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Christian Gallrapp

Christian Gallrapp appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

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Published work

2 published item(s)

preprint2012arXiv

Planar Pixel Sensors for the ATLAS tracker upgrade at HL-LHC

The ATLAS Planar Pixel Sensor R&D Project is a collaboration of 17 institutes and more than 80 scientists. Their goal is to explore the operation of planar pixel sensors for the tracker upgrade at the High Luminosity-Large Hadron Collider (HL-LHC). This work will give a summary of the achievements on radiation studies with n-in-n and n-in-p pixel sensors, bump-bonded to ATLAS FE-I3 and FE-I4 readout chips. The summary includes results from tests with radioactive sources and tracking efficiencies extracted from test beam measurements. Analysis results of ${2\cdot10^{16}} \text{n}_{\text{eq}}\text{cm}^{-2}$ and ${1\cdot10^{16}} \text{n}_{\text{eq}}\text{cm}^{-2}$ ($1 \text{MeV}$ neutron equivalent) irradiated n-in-n and n-in-p modules confirm the operation of planar pixel sensors for future applications.

preprint2011arXiv

Characterization and Performance of Silicon n-in-p Pixel Detectors for the ATLAS Upgrades

The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. N-in-p silicon devices are a promising candidate for tracking detectors to achieve these goals, since they are radiation hard, cost efficient and are not type inverted after irradiation. A n-in-p pixel production based on a MPP/HLL design and performed by CiS (Erfurt, Germany) on 300 μm thick Float-Zone material is characterised and the electrical properties of sensors and single chip modules (SCM) are presented, including noise, charge collection efficiencies, and measurements with MIPs as well as an 241Am source. The SCMs are built with sensors connected to the current the ATLAS read-out chip FE-I3. The characterisation has been performed with the ATLAS pixel read-out systems, before and after irradiation with 24 GeV/c protons. In addition preliminary testbeam results for the tracking efficiency and charge collection, obtained with a SCM, are discussed.