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A. Scherz

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Published work

4 published item(s)

preprint2022arXiv

Monochromatic operation of the SASE3 soft X-ray beamline at European XFEL

The SASE3 soft X-ray beamline at the European XFEL has been designed and built to provide experiments with pink or monochromatic beam in the photon energy range 250 eV - 3000 eV. Here, we focus on the monochromatic operation of the SASE3 beamline and report on design and performance of the SASE3 grating monochromator. The unique capability of an FEL source to produce short femtosecond pulses of high degree of coherence challenges the monochromator design by a demand to control both photon energy and temporal resolution. The aim to transport close to transform-limited pulses poses very high demands on the optics quality, in particular on the grating. The current realization of the SASE3 monochromator is discussed in comparison with optimal design performance. Presently, the monochromator operates with two gratings: the low-resolution grating is optimized for time-resolved experiments and allows for moderate resolving power of about 2000 - 5000 along with pulse stretching of few to few tens of femtoseconds RMS, and the high-resolution grating reaches resolving power of 10000 at a cost of larger pulse stretching.

preprint2011arXiv

Coherence Properties of Individual Femtosecond Pulses of an X-ray Free-Electron Laser

Measurements of the spatial and temporal coherence of single, femtosecond x-ray pulses generated by the first hard x-ray free-electron laser (FEL), the Linac Coherent Light Source (LCLS), are presented. Single shot measurements were performed at 780 eV x-ray photon energy using apertures containing double pinholes in "diffract and destroy" mode. We determined a coherence length of 17 micrometers in the vertical direction, which is approximately the size of the focused LCLS beam in the same direction. The analysis of the diffraction patterns produced by the pinholes with the largest separation yields an estimate of the temporal coherence time of 0.6 fs. We find that the total degree of transverse coherence is 56% and that the x-ray pulses are adequately described by two transverse coherent modes in each direction. This leads us to the conclusion that 78% of the total power is contained in the dominant mode.

preprint2011arXiv

Many-body effects in x-ray absorption and magnetic circular dichroism spectra within the LSDA+DMFT framework

The theoretical description of photoemission spectra of transition metals was greatly improved recently by accounting for the correlations between the d electrons within the local spin density approximation (LSDA) plus dynamical mean field theory (DMFT). We assess the improvement of the LSDA+DMFT over the plain LSDA in x-ray absorption spectroscopy, which --- unlike the photoemission spectroscopy --- is probing unocccupied electronic states. By investigating the L2,3-edge x-ray absorption near-edge structure (XANES) and x-ray magnetic circular dichroism (XMCD) of Fe, Co, and Ni, we find that the LSDA+DMFT improves the LSDA results, in particular concerning the asymmetry of the L3 white line. Differences with respect to the experiment, nevertheless, remain --- particularly concerning the ratio of the intensities of the L3 and L2 peaks. The changes in the XMCD peak intensities invoked by the use of the LSDA+DMFT are a consequence of the improved description of the orbital polarization and are consistent with the XMCD sum rules. Accounting for the core hole within the final state approximation does not generally improve the results. This indicates that to get more accurate L2,3-edge XANES and XMCD spectra, one has to treat the core hole beyond the final state approximation.

preprint2011arXiv

Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers

We have demonstrated a technique capable of in-line measurement of dielectric constant of low-k interconnect films on patterned wafers utilizing a test key of ~50x50 μm in size. The test key consists of a low-k film backed by a Cu grid with >50% metal pattern density and <250 nm pitch, which is fully compatible with the existing dual-damascene interconnect manufacturing processes. The technique is based on a near-field scanned microwave probe and is noncontact, noninvasive, and requires no electrical contact to or grounding of the wafer under test. It yields <0.3% precision and 2% accuracy for the film dielectric constant.