Abstract

We study Coulomb drag between the top and bottom surfaces of topological insulator films. We derive a kinetic equation for the thin-film spin density matrix containing the full spin structure of the two-layer system, and analyze the electron-electron interaction in detail in order to recover all terms responsible for Coulomb drag. Focusing on typical topological insulator systems, with film thicknesses d up to 6 nm, we obtain numerical and approximate analytical results for the drag resistivity ρDρ_\text{D} and find that ρDρ_\text{D} is proportional to T2d−4na−3/2np−3/2T^2d^{-4}n^{-3/2}_{\text{a}}n^{-3/2}_{\text{p}} at low temperature T and low electron density na,pn_{\text{a,p}}, with a denoting the active layer and p the passive layer. In addition, we compare ρDρ_{\text{D}} with graphene, identifying qualitative and quantitative differences, and we discuss the multi valley case, ultra thin films and electron-hole layers.

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