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Researcher profile

Xiaoqing Xu

Xiaoqing Xu contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
Computer Visioncond-mat.mtrl-sciHardware ArchitectureArtificial Intelligencecond-mat.mes-halleess.SYphysics.app-phSystems and Control

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Published work

6 published item(s)

preprint2026arXiv

Democratizing planetary-scale analysis: An ultra-lightweight Earth embedding database for accurate and flexible global land monitoring

The rapid evolution of satellite-borne Earth Observation (EO) systems has revolutionized terrestrial monitoring, yielding petabyte-scale archives. However, the immense computational and storage requirements for global-scale analysis often preclude widespread use, hindering planetary-scale studies. To address these barriers, we present Embedded Seamless Data (ESD), an ultra-lightweight, 30-m global Earth embedding database spanning the 25-year period from 2000 to 2024. By transforming high-dimensional, multi-sensor observations from the Landsat series (5, 7, 8, and 9) and MODIS Terra into information-dense, quantized latent vectors, ESD distills essential geophysical and semantic features into a unified latent space. Utilizing the ESDNet architecture and Finite Scalar Quantization (FSQ), the dataset achieves a transformative ~340-fold reduction in data volume compared to raw archives. This compression allows the entire global land surface for a single year to be encapsulated within approximately 2.4 TB, enabling decadal-scale global analysis on standard local workstations. Rigorous validation demonstrates high reconstructive fidelity (MAE: 0.0130; RMSE: 0.0179; CC: 0.8543). By condensing the annual phenological cycle into 12 temporal steps, the embeddings provide inherent denoising and a semantically organized space that outperforms raw reflectance in land-cover classification, achieving 79.74% accuracy (vs. 76.92% for raw fusion). With robust few-shot learning capabilities and longitudinal consistency, ESD provides a versatile foundation for democratizing planetary-scale research and advancing next-generation geospatial artificial intelligence.

0 citations0 reviewsNo code linkedOpen access
preprint2026arXiv

Wetland mapping from sparse annotations with satellite image time series and temporal-aware segment anything model

Accurate wetland mapping is essential for ecosystem monitoring, yet dense pixel-level annotation is prohibitively expensive and practical applications usually rely on sparse point labels, under which existing deep learning models perform poorly, while strong seasonal and inter-annual wetland dynamics further render single-date imagery inadequate and lead to significant mapping errors; although foundation models such as SAM show promising generalization from point prompts, they are inherently designed for static images and fail to model temporal information, resulting in fragmented masks in heterogeneous wetlands. To overcome these limitations, we propose WetSAM, a SAM-based framework that integrates satellite image time series for wetland mapping from sparse point supervision through a dual-branch design, where a temporally prompted branch extends SAM with hierarchical adapters and dynamic temporal aggregation to disentangle wetland characteristics from phenological variability, and a spatial branch employs a temporally constrained region-growing strategy to generate reliable dense pseudo-labels, while a bidirectional consistency regularization jointly optimizes both branches. Extensive experiments across eight global regions of approximately 5,000 km2 each demonstrate that WetSAM substantially outperforms state-of-the-art methods, achieving an average F1-score of 85.58%, and delivering accurate and structurally consistent wetland segmentation with minimal labeling effort, highlighting its strong generalization capability and potential for scalable, low-cost, high-resolution wetland mapping.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Analysis of the Mobility-Limiting Mechanisms of the Two-Dimensional Hole Gas on Hydrogen-Terminated Diamond

Here we present an analysis of the mobility-limiting mechanisms of a two-dimensional hole gas on hydrogen-terminated diamond surfaces. The scattering rates of surface impurities, surface roughness, non-polar optical phonons, and acoustic phonons are included. Using a Schrodinger/Poisson solver, the heavy hole, light hole, and split-off bands are treated separately. To compare the calculations with experimental data, Hall-effect structures were fabricated and measured at temperatures ranging from 25 to 700 K, with hole sheet densities ranging from 2 to 6$\times10^{12}\;\text{cm}^{-2}$ and typical mobilities measured from 60 to 100 cm$^{2}$/(V$\cdot$s) at room temperature. Existing data from literature was also used, which spans sheet densities above 1$\times10^{13}\;\text{cm}^{-2}$. Our analysis indicates that for low sheet densities, surface impurity scattering by charged acceptors and surface roughness are not sufficient to account for the low mobility. Moreover, the experimental data suggests that long-range potential fluctuations exist at the diamond surface, and are particularly enhanced at lower sheet densities. Thus, we propose a second type of surface impurity scattering which is caused by disorder related to the C-H dipoles.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Stack up your chips: Betting on 3D integration to augment Moore's Law scaling

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and cost but the actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges associated with 3D design and how design-for-3D will require us to break traditional silos of micro-architecture, circuit/physical design and manufacturing technology to work across abstractions to enable the gains promised by 3D technologies.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Temperature Dependent Thermal Boundary Conductance of Monolayer MoS$_2$ by Raman Thermometry

The electrical and thermal behavior of nanoscale devices based on two-dimensional (2D) materials is often limited by their contacts and interfaces. Here we report the temperature-dependent thermal boundary conductance (TBC) of monolayer MoS$_2$ with AlN and SiO$_2$, using Raman thermometry with laser-induced heating. The temperature-dependent optical absorption of the 2D material is crucial in such experiments, which we characterize here for the first time above room temperature. We obtain TBC ~ 15 MWm$^-$$^2$K$^-$$^1$ near room temperature, increasing as ~ T$^0$$^.$$^6$$^5$ in the range 300 - 600 K. The similar TBC of MoS$_2$ with the two substrates indicates that MoS$_2$ is the "softer" material with weaker phonon irradiance, and the relatively low TBC signifies that such interfaces present a key bottleneck in energy dissipation from 2D devices. Our approach is needed to correctly perform Raman thermometry of 2D materials, and our findings are key for understanding energy coupling at the nanoscale.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $μ$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12°C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking.

0 citations0 reviewsNo code linkedOpen access