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Saurabh Sinha

Saurabh Sinha appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

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Hardware Architectureeess.SYSoftware EngineeringSystems and Control

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Published work

3 published item(s)

preprint2022arXiv

Automated Test Generation for REST APIs: No Time to Rest Yet

Modern web services routinely provide REST APIs for clients to access their functionality. These APIs present unique challenges and opportunities for automated testing, driving the recent development of many techniques and tools that generate test cases for API endpoints using various strategies. Understanding how these techniques compare to one another is difficult, as they have been evaluated on different benchmarks and using different metrics. To fill this gap, we performed an empirical study aimed to understand the landscape in automated testing of REST APIs and guide future research in this area. We first identified, through a systematic selection process, a set of 10 state-of-the-art REST API testing tools that included tools developed by both researchers and practitioners. We then applied these tools to a benchmark of 20 real-world open-source RESTful services and analyzed their performance in terms of code coverage achieved and unique failures triggered. This analysis allowed us to identify strengths, weaknesses, and limitations of the tools considered and of their underlying strategies, as well as implications of our findings for future research in this area.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Stack up your chips: Betting on 3D integration to augment Moore's Law scaling

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and cost but the actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges associated with 3D design and how design-for-3D will require us to break traditional silos of micro-architecture, circuit/physical design and manufacturing technology to work across abstractions to enable the gains promised by 3D technologies.

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preprint2020arXiv

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $μ$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12°C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking.

0 citations0 reviewsNo code linkedOpen access