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Xiaodong Pi

Xiaodong Pi contributes to research discovery and scholarly infrastructure.

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Published work

4 published item(s)

preprint2022arXiv

Nitrogen decoration of basal plane dislocations in 4H-SiC

Basal-plane dislocations (BPDs) pose a great challenge to the reliability of bipolar power devices based on the 4H silicon carbide (4H-SiC). It is well established that heavy nitrogen (N) doping promotes the conversion of BPDs to threading edge dislocations (TEDs) and improves the reliability of 4H-SiC-based bipolar power devices. However, the interaction between N and BPDs, and the effect of N on the electronic properties of BPDs are still ambiguous, which significantly hinder the understanding on the electron-transport mechanism of 4H-SiC-based bipolar power devices. Combining molten-alkali etching and the Kelvin probe force microscopy (KPFM) analysis, we demonstrate that BPDs create acceptor-like states in undoped 4H-SiC, while acting as donors in N-doped 4H-SiC. First-principles calculations verify that BPDs create occupied defect states above the valence band maximum (VBM) and unoccupied defect states under the conduction-band minimum (CBM) of undoped 4H-SiC. The electron transfer from the defect states of intrinsic defects and native impurities to the unoccupied defect states of BPDs gives rise to the acceptor-like behavior of BPDs in undoped 4H-SiC. Defect formation energies indicate that N atoms can spontaneously decorate BPDs during the N doping of 4H-SiC. The binding between N and BPD is strong against decomposition. The accumulation of N dopants at the core of BPDs results in the accumulation of donor-like states at the core of BPDs in N-doped 4H-SiC. This work not only enriches the understanding on the electronic behavior of BPDs in N-doped 4H-SiC, but also helps understand the electron transport mechanism of 4H-SiC-based bipolar power devices.

preprint2022arXiv

Recent Progress of Heterostructures Based on Two Dimensional Materials and Wide Bandgap Semiconductors

Recent progress in the synthesis and assembly of two-dimensional (2D) materials has laid the foundation for various applications of atomically thin layer films. These 2D materials possess rich and diverse properties such as layer-dependent band gaps, interesting spin degrees of freedom, and variable crystal structures. They exhibit broad application prospects in micro-nano devices. In the meantime, the wide bandgap semiconductors (WBS) with an elevated breakdown voltage, high mobility, and high thermal conductivity have shown important applications in high-frequency microwave devices, high-temperature and high-power electronic devices. Beyond the study on single 2D materials or WBS materials, the multi-functional 2D/WBS heterostructures can promote the carrier transport at the interface, potentially providing novel physical phenomena and applications, and improving the performance of electronic and optoelectronic devices. In this review, we overview the advantages of the heterostructures of 2D materials and WBS materials, and introduce the construction methods of 2D/WBS heterostructures. Then, we present the diversity and recent progress in the applications of 2D/WBS heterostructures, including photodetectors, photocatalysis, sensors, and energy related devices. Finally, we put forward the current challenges of 2D/WBS heterostructures and propose the promising research directions in the future.

preprint2022arXiv

Towards Wafer-Scale Production of TwoDimensional Transition Metal Chalcogenides

Two-dimensional (2D) Transition Metal Chalcogenides (TMCs) have attracted tremendous interest from both the scientific and technological communities due to their variety of properties and superior tunability through layer number, composition, and interface engineering. Wafer-scale production of 2D TMCs is critical to the industrial applications of these materials. Extensive efforts have been bestowed to the large-area growth of 2D TMCs through various approaches. In this review, recent advances in obtaining large-area 2D TMCs by different methods such as chemical vapor deposition (CVD), metal-organic CVD, physical vapor deposition are firstly highlighted and their advantages and disadvantages are also evaluated. Then strategies for the control of the grains, morphology, layer number and phase to achieve controllable and uniform thicknesses and large crystal domains for 2D TMCs are discussed. Applications of large-area 2D TMCs in electronics, optoelectronics, spintronics etc. are also introduced. Finally, ideas and prospects for the future developments of wafer-scale 2D TMCs are provided.

preprint2021arXiv

Improving the doping efficiency of Al in 4H-SiC by co-doping group-IVB elements

The p-type doping efficiency of 4H silicon carbide (4H-SiC) is rather low due to the large ionization energies of p-type dopants. Such an issue impedes the exploration of the full advantage of 4H-SiC for semiconductor devices. In this letter, we show that co-doping group-IVB elements effectively decreases the ionization energy of the most widely used p-type dopant, i. e., aluminum (Al), through the Coulomb repulsion between the energy levels of group-IVB elements and that of Al in 4H-SiC. Among group-IVB elements Ti has the most prominent effectiveness. Ti decreases the ionization energy of Al by nearly 50%, leading to a value as low as ~ 0.13 eV. As a result, the ionization rate of Al with Ti co-doping is up to ~ 5 times larger than that without co-doping at room temperature when the doping concentration is up to 1018 cm-3. This work may encourage the experimental co-doping of group-IB elements such as Ti and Al to significantly improve the p-type doping efficiency of 4H-SiC.