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V. Dotsenko

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Published work

4 published item(s)

preprint2015arXiv

Critical Casimir forces in the presence of random surface fields

We study critical Casimir forces (CCF) $f_{\mathrm C}$ for films of thickness $L$ which in the three-dimensional bulk belong to the Ising universality class and which are exposed to random surface fields (RSF) on both surfaces. We consider the case that, in the absence of RSF, the surfaces of the film belong to the surface universality class of the so-called ordinary transition. We carry out a finite-size scaling analysis and show that for weak disorder CCF still exhibit scaling, acquiring a random field scaling variable $w$ which is zero for pure systems. We confirm these analytic predictions by MC simulations. Moreover, our MC data show that $f_{\mathrm C}$ varies as $f_{\mathrm C}(w\to 0)-f_{\mathrm C}(w=0)\sim w^2$. Asymptotically, for large $L$, $w$ scales as $w \sim L^{-0.26} \to 0$ indicating that this type of disorder is an irrelevant perturbation of the ordinary surface universality class. However, for thin films such that $w \simeq 1$, we find that the presence of RSF with vanishing mean value increases significantly the strength of CCF, as compared to systems without them, and shifts the extremum of the scaling function of $f_{\mathrm C}$ towards lower temperatures. But $f_{\mathrm C}$ remains attractive.

preprint2012arXiv

Design and testing of high-speed interconnects for Superconducting multi-chip modules

Superconducting single flux quantum (SFQ) circuits can process information at extremely high speeds, in the range of hundreds of GHz. SFQ circuits are based on Josephson junction cells for switching logic and ballistic transmission for transferring SFQ pulses. Multi-chip modules (MCM) are often used to implement larger complex designs, which cannot be fit onto a single chip. We have optimized the design of wideband interconnects for transferring signals and SFQ pulses between chips in flip-chip MCMs and evaluated the importance of several design parameters such as the geometry of bump pads on chips, length of passive micro-strip lines (MSL)s, number of corners in MSLs as well as flux trapping and fabrication effects on the operating margins of the MCMs. Several test circuits have been designed to evaluate the above mentioned features and fabricated in the framework of 4.5-kA/cm2 HYPRES process. The MCMs bumps for electrical connections have been deposited using the waferlevel electroplating process. We have found that, at the optimized configuration, the maximum operating frequency of the MCM test circuit, a ring oscillator with chip-to-chip connections, approaches 100 GHz and is not noticeably affected by the presence of MCM interconnects, decreasing only about 3% with respect to the same circuit with no inter-chip connections.