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Sumeet K. Gupta

Sumeet K. Gupta contributes to research discovery and scholarly infrastructure.

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Published work

3 published item(s)

preprint2022arXiv

ADRA: Extending Digital Computing-in-Memory with Asymmetric Dual-Row-Activation

Computing in-memory (CiM) has emerged as an attractive technique to mitigate the von-Neumann bottleneck. Current digital CiM approaches for in-memory operands are based on multi-wordline assertion for computing bit-wise Boolean functions and arithmetic functions such as addition. However, most of these techniques, due to the many-to-one mapping of input vectors to bitline voltages, are limited to CiM of commutative functions, leaving out an important class of computations such as subtraction. In this paper, we propose a CiM approach, which solves the mapping problem through an asymmetric wordline biasing scheme, enabling (a) simultaneous single-cycle memory read and CiM of primitive Boolean functions (b) computation of any Boolean function and (c) CiM of non-commutative functions such as subtraction and comparison. While the proposed technique is technology-agnostic, we show its utility for ferroelectric transistor (FeFET)-based non-volatile memory. Compared to the standard near-memory methods (which require two full memory accesses per operation), we show that our method can achieve a full scale two-operand digital CiM using just one memory access, leading to a 23.2% - 72.6% decrease in energy-delay product (EDP).

preprint2022arXiv

STeP-CiM: Strain-enabled Ternary Precision Computation-in-Memory based on Non-Volatile 2D Piezoelectric Transistors

We propose 2D Piezoelectric FET (PeFET) based compute-enabled non-volatile memory for ternary deep neural networks (DNNs). PeFETs consist of a material with ferroelectric and piezoelectric properties coupled with Transition Metal Dichalcogenide channel. We utilize (a) ferroelectricity to store binary bits (0/1) in the form of polarization (-P/+P) and (b) polarization dependent piezoelectricity to read the stored state by means of strain-induced bandgap change in Transition Metal Dichalcogenide channel. The unique read mechanism of PeFETs enables us to expand the traditional association of +P (-P) with low (high) resistance states to their dual high (low) resistance depending on read voltage. Specifically, we demonstrate that +P (-P) stored in PeFETs can be dynamically configured in (a) a low (high) resistance state for positive read voltages and (b) their dual high (low) resistance states for negative read voltages, without afflicting a read disturb. Such a feature, which we name as Polarization Preserved Piezoelectric Effect Reversal with Dual Voltage Polarity (PiER), is unique to PeFETs and has not been shown in hitherto explored memories. We leverage PiER to propose a Strain-enabled Ternary Precision Computation-in-Memory (STeP-CiM) cell with capabilities of computing the scalar product of the stored weight and input, both of which are represented with signed ternary precision. Further, using multi word-line assertion of STeP-CiM cells, we achieve massively parallel computation of dot products of signed ternary inputs and weights. Our array level analysis shows 91% lower delay and improvements of 15% and 91% in energy for in-memory multiply-and-accumulate operations compared to near-memory design approaches based on SRAM and PeFET respectively. STeP-CiM exhibits upto 8.91x improvement in performance and 6.07x average improvement in energy over SRAM/PeFET based near-memory design.

preprint2020arXiv

A Ferroelectric Semiconductor Field-Effect Transistor

Ferroelectric field-effect transistors employ a ferroelectric material as a gate insulator, the polarization state of which can be detected using the channel conductance of the device. As a result, the devices are of potential to use in non-volatile memory technology, but suffer from short retention times, which limits their wider application. Here we report a ferroelectric semiconductor field-effect transistor in which a two-dimensional ferroelectric semiconductor, indium selenide (α-In2Se3), is used as the channel material in the device. α-In2Se3 was chosen due to its appropriate bandgap, room temperature ferroelectricity, ability to maintain ferroelectricity down to a few atomic layers, and potential for large-area growth. A passivation method based on the atomic-layer deposition of aluminum oxide (Al2O3) was developed to protect and enhance the performance of the transistors. With 15-nm-thick hafnium oxide (HfO2) as a scaled gate dielectric, the resulting devices offer high performance with a large memory window, a high on/off ratio of over 108, a maximum on-current of 862 μA μm-1, and a low supply voltage.