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Atanu K. Saha

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2 published item(s)

preprint2022arXiv

ADRA: Extending Digital Computing-in-Memory with Asymmetric Dual-Row-Activation

Computing in-memory (CiM) has emerged as an attractive technique to mitigate the von-Neumann bottleneck. Current digital CiM approaches for in-memory operands are based on multi-wordline assertion for computing bit-wise Boolean functions and arithmetic functions such as addition. However, most of these techniques, due to the many-to-one mapping of input vectors to bitline voltages, are limited to CiM of commutative functions, leaving out an important class of computations such as subtraction. In this paper, we propose a CiM approach, which solves the mapping problem through an asymmetric wordline biasing scheme, enabling (a) simultaneous single-cycle memory read and CiM of primitive Boolean functions (b) computation of any Boolean function and (c) CiM of non-commutative functions such as subtraction and comparison. While the proposed technique is technology-agnostic, we show its utility for ferroelectric transistor (FeFET)-based non-volatile memory. Compared to the standard near-memory methods (which require two full memory accesses per operation), we show that our method can achieve a full scale two-operand digital CiM using just one memory access, leading to a 23.2% - 72.6% decrease in energy-delay product (EDP).

preprint2020arXiv

A Ferroelectric Semiconductor Field-Effect Transistor

Ferroelectric field-effect transistors employ a ferroelectric material as a gate insulator, the polarization state of which can be detected using the channel conductance of the device. As a result, the devices are of potential to use in non-volatile memory technology, but suffer from short retention times, which limits their wider application. Here we report a ferroelectric semiconductor field-effect transistor in which a two-dimensional ferroelectric semiconductor, indium selenide (α-In2Se3), is used as the channel material in the device. α-In2Se3 was chosen due to its appropriate bandgap, room temperature ferroelectricity, ability to maintain ferroelectricity down to a few atomic layers, and potential for large-area growth. A passivation method based on the atomic-layer deposition of aluminum oxide (Al2O3) was developed to protect and enhance the performance of the transistors. With 15-nm-thick hafnium oxide (HfO2) as a scaled gate dielectric, the resulting devices offer high performance with a large memory window, a high on/off ratio of over 108, a maximum on-current of 862 μA μm-1, and a low supply voltage.