Researcher profile

Samantha Roberts

Samantha Roberts contributes to research discovery and scholarly infrastructure.

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Published work

3 published item(s)

preprint2023arXiv

Ultra-Low-Loss Silicon Nitride Photonics Based on Deposited Films Compatible with Foundries

The fabrication processes of silicon nitride photonic devices used in foundries require low temperature deposition, which typically leads to high propagation losses. Here, we show that propagation loss as low as 0.42 dB/cm can be achieved using foundry compatible processes by solely reducing waveguide surface roughness. By post-processing the fabricated devices using rapid thermal anneal (RTA) and furnace anneal, we achieve propagation losses down to 0.28 dB/cm and 0.06 dB/cm, respectively. These low losses are comparable to the conventional devices using high temperature, high-stress low-pressure chemical vapor deposition (LPCVD) films. We also tune the dispersion of the devices, and proved that these devices can be used for linear and nonlinear applications. Low threshold parametric oscillation, broadband frequency combs and narrow-linewidth laser are demonstrated. Our work demonstrates the feasibility of scalable photonic systems based on foundries.

preprint2022arXiv

Measurements and modeling of atomic-scale sidewall roughness and losses in integrated photonic devices

Atomic-level imperfections play an increasingly critical role in nanophotonic device performance. However, it remains challenging to accurately characterize the sidewall roughness with sub-nanometer resolution and directly correlate this roughness with device performance. We have developed a method that allows us to measure the sidewall roughness of waveguides made of any material (including dielectrics) using the high resolution of atomic force microscopy. We illustrate this method by measuring state-of-the-art photonic devices made of silicon nitride. We compare the roughness of devices fabricated using both DUV photo-lithography and electron-beam lithography for two different etch processes. To correlate roughness with device performance we describe what we call a new Payne-Lacey Bending model, which adds a correction factor to the widely used Payne-Lacey model so that losses in resonators and waveguides with bends can be accurately predicted given the sidewall roughness, waveguide width and bending radii. Having a better way to measure roughness and use it to predict device performance can allow researchers and engineers to optimize fabrication for state-of-the-art photonics using many materials.

preprint2019arXiv

Integrated near-field thermo-photovoltaics for on-demand heat recycling

The energy transferred via thermal radiation between two surfaces separated by nanometers distances (near-field) can be much larger than the blackbody limit. However, realizing a reconfigurable platform that utilizes this energy exchange mechanism to generate electricity in industrial and space applications on-demand, remains a challenge. The challenge lies in designing a platform that can separate two surfaces by a small and tunable gap while simultaneously maintaining a large temperature differential. Here, we present a fully integrated, reconfigurable and scalable platform operating in near-field regime that performs controlled heat extraction and energy recycling. Our platform relies on an integrated nano-electromechanical system (NEMS) that enables precise positioning of a large area thermal emitter within nanometers distances from a room-temperature germanium photodetector to form a thermo-photovoltaic (TPV) cell. We show over an order of magnitude higher power generation $\mathrm{P_{gen} \sim 1.25 \, μW \cdot cm^{-2}}$ from our TPV cell by tuning the gap between a hot emitter ($\mathrm{T_E \sim 880 \, K}$) and the cold photodetector ($\mathrm{T_D \sim 300 \, K}$) from $\mathrm{\sim 500 \, nm}$ to $\mathrm{\sim 100 \, nm}$. The significant enhancement in $\mathrm{P_{gen}}$ at such small distances is a clear indication of near-field heat transfer effect. Our electrostatically controlled NEMS switch consumes negligible tuning power ($\mathrm{P_{gen}/P_{NEMS} \sim 10^4}$) and relies on conventional silicon-based process technologies.