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Researcher profile

Meinert Jordan

Meinert Jordan contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
physics.opticsNetworking and Internet Architecture

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Published work

2 published item(s)

preprint2016arXiv

Single-laser 32.5 Tbit/s Nyquist WDM transmission

We demonstrate 32.5 Tbit/s 16QAM Nyquist WDM transmission over a total length of 227 km of SMF-28 without optical dispersion compensation. A number of 325 optical carriers are derived from a single laser and encoded with dual-polarization 16QAM data using sinc-shaped Nyquist pulses. As we use no guard bands, the carriers have a spacing of 12.5 GHz equal to the Nyquist bandwidth of the data. We achieve a high net spectral efficiency of 6.4 bit/s/Hz using a software-defined transmitter which generates the electrical modulator drive signals in real-time.

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preprint2011arXiv

Photonic Wire Bonds for Terabit/s Chip-to-Chip Interconnects

Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with Terabit/s data rates have come into reach. However, as on-chip integration density increases, efficient off-chip interfaces are becoming more and more crucial. A technological breakthrough is considered indispensable to cope with the challenges arising from large-scale photonic integration, and this particularly applies to short-distance optical interconnects. In this letter we introduce the concept of photonic wire bonding, where transparent waveguide wire bonds are used to bridge the gap between nanophotonic circuits located on different chips. We demonstrate for the first time the fabrication of three-dimensional freeform photonic wire bonds (PWB), and we confirm their viability in a multi-Terabit/s data transmission experiment. First-generation prototypes allow for efficient broadband coupling with overall losses of only 1.6 dB. Photonic wire bonding will enable flexible optical multi-chip assemblies, thereby challenging the current paradigm of highly-complex monolithic integration.

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