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Johann Knechtel

Johann Knechtel contributes to research discovery and scholarly infrastructure.

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Published work

10 published item(s)

preprint2026arXiv

LLMs for Secure Hardware Design and Related Problems: Opportunities and Challenges

The integration of Large Language Models (LLMs) into Electronic Design Automation (EDA) and hardware security is rapidly reshaping the semiconductor industry. While LLMs offer unprecedented capabilities in generating Register Transfer Level (RTL) code, automating testbenches, and bridging the semantic gap between high-level specifications and silicon, they simultaneously introduce severe vulnerabilities. This comprehensive review provides an in-depth analysis of the state-of-the-art in LLM-driven hardware design, organized around key advancements in EDA synthesis, hardware trust, design for security, and education. We systematically expand on the methodologies of recent breakthroughs -- from reasoning-driven synthesis and multi-agent vulnerability extraction to data contamination and adversarial machine learning (ML) evasion. We integrate general discussions on critical countermeasures, such as dynamic benchmarking to combat data memorization and aggressive red-teaming for robust security assessment. Finally, we synthesize cross-cutting lessons learned to guide future research toward secure, trustworthy, and autonomous design ecosystems.

preprint2022arXiv

Coherence Attacks and Countermeasures in Interposer-Based Systems

Industry is moving towards large-scale systems where processor cores, memories, accelerators, etc.\ are bundled via 2.5D integration. These various components are fabricated separately as chiplets and then integrated using an interconnect carrier, a so-called interposer. This new design style provides benefits in terms of yield as well as economies of scale, as chiplets may come from various third-party vendors, and be integrated into one sophisticated system. The benefits of this approach, however, come at the cost of new challenges for the system's security and integrity when many third-party component chiplets, some from not fully trusted vendors, are integrated. Here, we explore these challenges, but also promises, for modern interposer-based systems of cache-coherent, multi-core chiplets. First, we introduce a new, coherence-based attack, GETXspy, wherein a single compromised chiplet can expose a high-bandwidth side/covert-channel in an ostensibly secure system. We further show that prior art is insufficient to stop this new attack. Second, we propose using an active interposer as generic, secure-by-construction platform that forms a physical root of trust for modern 2.5D systems. Our scheme has limited overhead, restricted to the active interposer, allowing the chiplets and the coherence system to remain untouched. We show that our scheme prevents a wide range of attacks, including but not limited to our GETXspy attack, with little overhead on system performance, $\sim$4\%. This overhead reduces as workloads increase, ensuring scalability of the scheme.

preprint2022arXiv

GNN4REL: Graph Neural Networks for Predicting Circuit Reliability Degradation

Process variations and device aging impose profound challenges for circuit designers. Without a precise understanding of the impact of variations on the delay of circuit paths, guardbands, which keep timing violations at bay, cannot be correctly estimated. This problem is exacerbated for advanced technology nodes, where transistor dimensions reach atomic levels and established margins are severely constrained. Hence, traditional worst-case analysis becomes impractical, resulting in intolerable performance overheads. Contrarily, process-variation/aging-aware static timing analysis (STA) equips designers with accurate statistical delay distributions. Timing guardbands that are small, yet sufficient, can then be effectively estimated. However, such analysis is costly as it requires intensive Monte-Carlo simulations. Further, it necessitates access to confidential physics-based aging models to generate the standard-cell libraries required for STA. In this work, we employ graph neural networks (GNNs) to accurately estimate the impact of process variations and device aging on the delay of any path within a circuit. Our proposed GNN4REL framework empowers designers to perform rapid and accurate reliability estimations without accessing transistor models, standard-cell libraries, or even STA; these components are all incorporated into the GNN model via training by the foundry. Specifically, GNN4REL is trained on a FinFET technology model that is calibrated against industrial 14nm measurement data. Through our extensive experiments on EPFL and ITC-99 benchmarks, as well as RISC-V processors, we successfully estimate delay degradations of all paths -- notably within seconds -- with a mean absolute error down to 0.01 percentage points.

preprint2021arXiv

UNSAIL: Thwarting Oracle-Less Machine Learning Attacks on Logic Locking

Logic locking aims to protect the intellectual property (IP) of integrated circuit (IC) designs throughout the globalized supply chain. The SAIL attack, based on tailored machine learning (ML) models, circumvents combinational logic locking with high accuracy and is amongst the most potent attacks as it does not require a functional IC acting as an oracle. In this work, we propose UNSAIL, a logic locking technique that inserts key-gate structures with the specific aim to confuse ML models like those used in SAIL. More specifically, UNSAIL serves to prevent attacks seeking to resolve the structural transformations of synthesis-induced obfuscation, which is an essential step for logic locking. Our approach is generic; it can protect any local structure of key-gates against such ML-based attacks in an oracle-less setting. We develop a reference implementation for the SAIL attack and launch it on both traditionally locked and UNSAIL-locked designs. In SAIL, a change-prediction model is used to determine which key-gate structures to restore using a reconstruction model. Our study on benchmarks ranging from the ISCAS-85 and ITC-99 suites to the OpenRISC Reference Platform System-on-Chip (ORPSoC) confirms that UNSAIL degrades the accuracy of the change-prediction model and the reconstruction model by an average of 20.13 and 17 percentage points (pp) respectively. When the aforementioned models are combined, which is the most powerful scenario for SAIL, UNSAIL reduces the attack accuracy of SAIL by an average of 11pp. We further demonstrate that UNSAIL thwarts other oracle-less attacks, i.e., SWEEP and the redundancy attack, indicating the generic nature and strength of our approach. Detailed layout-level evaluations illustrate that UNSAIL incurs minimal area and power overheads of 0.26% and 0.61%, respectively, on the million-gate ORPSoC design.

preprint2020arXiv

Attacking Split Manufacturing from a Deep Learning Perspective

The notion of integrated circuit split manufacturing which delegates the front-end-of-line (FEOL) and back-end-of-line (BEOL) parts to different foundries, is to prevent overproduction, piracy of the intellectual property (IP), or targeted insertion of hardware Trojans by adversaries in the FEOL facility. In this work, we challenge the security promise of split manufacturing by formulating various layout-level placement and routing hints as vector- and image-based features. We construct a sophisticated deep neural network which can infer the missing BEOL connections with high accuracy. Compared with the publicly available network-flow attack [1], for the same set of ISCAS-85 benchmarks, we achieve 1.21X accuracy when splitting on M1 and 1.12X accuracy when splitting on M3 with less than 1% running time.

preprint2020arXiv

Obfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging

Layout camouflaging can protect the intellectual property of modern circuits. Most prior art, however, incurs excessive layout overheads and necessitates customization of active-device manufacturing processes, i.e., the front-end-of-line (FEOL). As a result, camouflaging has typically been applied selectively, which can ultimately undermine its resilience. Here, we propose a low-cost and generic scheme---full-chip camouflaging can be finally realized without reservations. Our scheme is based on obfuscating the interconnects, i.e., the back-end-of-line (BEOL), through design-time handling for real and dummy wires and vias. To that end, we implement custom, BEOL-centric obfuscation cells, and develop a CAD flow using industrial tools. Our scheme can be applied to any design and technology node without FEOL-level modifications. Considering its BEOL-centric nature, we advocate applying our scheme in conjunction with split manufacturing, to furthermore protect against untrusted fabs. We evaluate our scheme for various designs at the physical, DRC-clean layout level. Our scheme incurs a significantly lower cost than most of the prior art. Notably, for fully camouflaged layouts, we observe average power, performance, and area overheads of 24.96%, 19.06%, and 32.55%, respectively. We conduct a thorough security study addressing the threats (attacks) related to untrustworthy FEOL fabs (proximity attacks) and malicious end-users (SAT-based attacks). An empirical key finding is that only large-scale camouflaging schemes like ours are practically secure against powerful SAT-based attacks. Another key finding is that our scheme hinders both placement- and routing-centric proximity attacks; correct connections are reduced by 7.47X, and complexity is increased by 24.15X, respectively, for such attacks.

preprint2020arXiv

Opening the Doors to Dynamic Camouflaging: Harnessing the Power of Polymorphic Devices

The era of widespread globalization has led to the emergence of hardware-centric security threats throughout the IC supply chain. Prior defenses like logic locking, layout camouflaging, and split manufacturing have been researched extensively to protect against intellectual property (IP) piracy at different stages. In this work, we present dynamic camouflaging as a new technique to thwart IP reverse engineering at all stages in the supply chain, viz., the foundry, the test facility, and the end-user. Toward this end, we exploit the multi-functionality, post-fabrication reconfigurability, and run-time polymorphism of spin-based devices, specifically the magneto-electric spin-orbit (MESO) device. Leveraging these unique properties, dynamic camouflaging is shown to be resilient against state-of-the-art analytical SAT-based attacks and test-data mining attacks. Such dynamic reconfigurability is not afforded in CMOS owing to fundamental differences in operation. For such MESO-based camouflaging, we also anticipate massive savings in power, performance, and area over other spin-based camouflaging schemes, due to the energy-efficient electric-field driven reversal of the MESO device. Based on thorough experimentation, we outline the promises of dynamic camouflaging in securing the supply chain end-to-end along with a case study, demonstrating the efficacy of dynamic camouflaging in securing error-tolerant image processing IP.

preprint2020arXiv

Power Side-Channel Attacks in Negative Capacitance Transistor (NCFET)

Side-channel attacks have empowered bypassing of cryptographic components in circuits. Power side-channel (PSC) attacks have received particular traction, owing to their non-invasiveness and proven effectiveness. Aside from prior art focused on conventional technologies, this is the first work to investigate the emerging Negative Capacitance Transistor (NCFET) technology in the context of PSC attacks. We implement a CAD flow for PSC evaluation at design-time. It leverages industry-standard design tools, while also employing the widely-accepted correlation power analysis (CPA) attack. Using standard-cell libraries based on the 7nm FinFET technology for NCFET and its counterpart CMOS setup, our evaluation reveals that NCFET-based circuits are more resilient to the classical CPA attack, due to the considerable effect of negative capacitance on the switching power. We also demonstrate that the thicker the ferroelectric layer, the higher the resiliency of the NCFET-based circuit, which opens new doors for optimization and trade-offs.

preprint2020arXiv

SMART: Secure Magnetoelectric AntifeRromagnet-Based Tamper-Proof Non-Volatile Memory

The storage industry is moving toward emerging non-volatile memories (NVMs), including the spin-transfer torque magnetoresistive random-access memory (STT-MRAM) and the phase-change memory (PCM), owing to their high density and low-power operation. In this paper, we demonstrate, for the first time, circuit models and performance benchmarking for the domain wall (DW) reversal-based magnetoelectric-antiferromagnetic random access memory (ME-AFMRAM) at cell-level and at array-level. We also provide perspectives for coherent rotation-based memory switching with topological insulator-driven anomalous Hall read-out. In the coherent rotation regime, the ultra-low power magnetoelectric switching coupled with the terahertz-range antiferromagnetic dynamics result in substantially lower energy-per-bit and latency metrics for the ME-AFMRAM compared to other NVMs including STTMRAM and PCM. After characterizing the novel ME-AFMRAM, we leverage its unique properties to build a dense, on-chip, secure NVM platform, called SMART: A Secure Magnetoelectric Antiferromagnet- Based Tamper-Proof Non-Volatile Memory. New NVM technologies open up challenges and opportunities from a data-security perspective. For example, their sensitivity to magnetic fields and temperature fluctuations, and their data remanence after power-down make NVMs vulnerable to data theft and tampering attacks. The proposed SMART memory is not only resilient against data confidentiality attacks seeking to leak sensitive information but also ensures data integrity and prevents Denial-of-Service (DoS) attacks on the memory. It is impervious to particular power side-channel (PSC) attacks which exploit asymmetric read/write signatures for 0 and 1 logic levels, and photonic side-channel attacks which monitor photo-emission signatures from the chip backside.

preprint2019arXiv

3D Integration: Another Dimension Toward Hardware Security

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.