Researcher profile

Jean-François Arguin

Jean-François Arguin contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2022arXiv

Variational Autoencoders for Anomalous Jet Tagging

We present a detailed study on Variational Autoencoders (VAEs) for anomalous jet tagging at the Large Hadron Collider. By taking in low-level jet constituents' information, and training with background QCD jets in an unsupervised manner, the VAE is able to encode important information for reconstructing jets, while learning an expressive posterior distribution in the latent space. When using the VAE as an anomaly detector, we present different approaches to detect anomalies: directly comparing in the input space or, instead, working in the latent space. In order to facilitate general search approaches such as bump-hunt, mass-decorrelated VAEs based on distance correlation regularization are also studied. We find that the naive mass-decorrelated VAEs fail at maintaining proper detection performance, by assigning higher probabilities to some anomalous samples. To build a performant mass-decorrelated anomalous jet tagger, we propose the Outlier Exposed VAE (OE-VAE), for which some outlier samples are introduced in the training process to guide the learned information. OE-VAEs are employed to achieve two goals at the same time: increasing sensitivity of outlier detection and decorrelating jet mass from the anomaly score. We succeed in reaching excellent results from both aspects. Code implementation of this work can be found at https://github.com/taolicheng/VAE-Jet

preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.