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Dirk Wiedner

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Published work

4 published item(s)

preprint2016arXiv

Feasibility studies for a wireless 60 GHz tracking detector readout

The amount of data produced by highly granular silicon tracking detectors in high energy physics experiments poses a major challenge to readout systems. At high collision rates, e.g. at LHC experiments, only a small fraction of data can be read out with currently used technologies. To cope with the requirements of future or upgraded experiments new data transfer techniques are required which offer high data rates at low power and low material budget. Wireless technologies operating in the 60 GHz band or at higher frequencies offer high data rates and are thus a promising upcoming alternative to conventional data transmission via electrical cables or optical fibers. Using wireless technology, the amount of cables and connectors in detectors can be significantly reduced. Tracking detectors profit most from a reduced material budget as fewer secondary particle interactions (multiple Coulomb scattering, energy loss, etc.) improve the tracking performance in general. We present feasibility studies regarding the integration of the wireless technology at 60 GHz into a silicon tracking detector. Spare silicon strip modules of the ATLAS experiment are measured to be opaque in the 60 GHz range. The reduction of cross talk between links is studied. An estimate of the maximum achievable link density is given. It is shown that wireless links can be placed as close as 2 cm next to each other for a layer distance of 10 cm by exploiting one or several of the following measures: highly directive antennas, absorbers, linear polarization and frequency channeling. Combining these measures, a data rate area density of up to 11 Tb/(s $\cdot$ m$^2$) seems feasible. In addition, two types of silicon sensors are tested under mm-wave irradiation . No deterioration of the performance of both prototypes is observed.

preprint2016arXiv

The MuPix System-on-Chip for the Mu3e Experiment

Mu3e is a novel experiment searching for charged lepton flavor violation in the rare decay $μ^+ \rightarrow e^+e^-e^+$. Decay vertex position, decay time and particle momenta have to be precisely measured in order to reject both accidental and physics background. A silicon pixel tracker based on $50\,μ$m thin high voltage monolithic active pixel sensors (HV-MAPS) in a 1 T solenoidal magnetic field provides precise vertex and momentum information. The MuPix chip combines pixel sensor cells with integrated analog electronics and a periphery with a complete digital readout. The MuPix7 is the first HV-MAPS prototype implementing all functionalities of the final sensor including a readout state machine and high speed serialization with 1.25 Gbit/s data output, allowing for a streaming readout in parallel to the data taking. The observed efficiency of the MuPix7 chip including the full readout system is $\geq99\%$ in a high rate test beam.

preprint2014arXiv

Multiple Coulomb Scattering in Thin Silicon

We present a measurement of multiple Coulomb scattering of 1 to 6 GeV/c electrons in thin (50-140 um) silicon targets. The data were obtained with the EUDET telescope Aconite at DESY and are compared to parametrisations as used in the Geant4 software package. We find good agreement between data and simulation in the scattering distribution width but large deviations in the shape of the distribution. In order to achieve a better description of the shape, a new scattering model based on a Student's t distribution is developed and compared to the data.

preprint2013arXiv

A Tracker for the Mu3e Experiment based on High-Voltage Monolithic Active Pixel Sensors

The Mu3e experiment searches for the lepton flavour violating decay mu+ -> e+e-e+, aiming for a branching fraction sensitivity of 10^-16. This requires an excellent momentum resolution for low energy electrons, high rate capability and a large acceptance. In order to minimize multiple scattering, the amount of material has to be as small as possible. These challenges can be met with a tracker built from high-voltage monolithic active pixel sensors (HV-MAPS), which can be thinned to 50 um and which incorporate the complete read-out electronics on the sensor chip. To further minimise material, the sensors are supported by a mechanical structure built from 25 um thick Kapton foil and cooled with gaseous helium.