Paper detail

Packaging-enhanced optical fiber-chip interconnect with enlarged grating coupler and multimode fiber

Optical I/O plays a crucial role in the lifespan of lab-on-a-chip systems, from preliminary testing to operation in the target environment. However, due to the precise alignments required, efficient and reliable fiber-to-chip connections remain challenging, yielding inconsistent test results and unstable packaged performance. To overcome this issue, for use in single mode on-chip systems, we propose the incorporation of area-enlarged grating couplers working in conjunction with multimode fibers. This combination enables simpler, faster, and more reliable connections than the traditional small area grating coupler with single-mode fiber. In this work, we experimentally demonstrate a 3dB in-plane (X, Y) spatial tolerance of (10.2 μm, 17.3 μm) for the large area configuration, being at least (2.49, 3.33) times that of the small area one, and agreeing well with theoretical calculations. The simple concept is readily applicable to a range of photonic systems where cheaper more robust optical I/O is desired.