BZPEERPapers, people, evidence and research paths
Menu

Discover

SearchFind papers, people, topics, institutions and opportunities from one place.GraphSee how papers, authors, topics and evidence connect.

Research tools

HomeContinue from the papers, people and topics that matter now.CollectionsTurn saved papers into reading lists, evidence maps and shareable context.ResearchReconstruct the path that led you from search to paper to question.CollaborationMove from a paper, topic or expert request into a focused thread.PublishCreate full-text research articles with metadata, formulas and versions.

Network

ExpertsFind specialists whose work and reviews explain why they can help.CommunitiesJoin research groups organized around papers, topics and shared evidence.

Opportunities

ListingsBrowse roles, calls and collaborations connected to real research context.

Account

Log inReturn to your saved papers, graph views and active threads.Create accountStart saving papers, building a research trail and joining teams.
Log inCreate account

Paper detail

Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab

Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The Flip Chip on Board (FCOB) procedure is an especially attractive packaging method for applications requiring a large number of connections at moderate pitch. This paper reports on the successful demonstration of FCOB assembly based on solder bumps down to 250um pitch using a SUESS MA8 flip chip bonder at Fermilab. The assembly procedure will be described, microscopic cross sections of the connections are shown, and first measurements on the contact resistance are presented.

preprint2009arXivOpen access
M. TrimplE. SkupR. YaremaJ. C. Yun
physics.ins-det
Open graphReviewsDiscussion

Signal facts

What is known right now

Open access4 authors1 topic
Imported metadata coverageMissing code, dataset, citation and institution fields are tracked without dominating the paper.Details
Citations: 0Reviews: 0Saves: 0Code: not linkedDataset: not linkedInstitutions: 0

Next steps

Decide what to do with this paper

Like0Dislike0Score 0

Use like or dislike for the fast social read. The more specific scholarly feedback stays available below when needed.

Save to reading list0
Log in to curate

Reading frame

Keep the important context close to the paper

Keep the important signals around this paper in one place: votes, save state, collection context, reviews and the metadata you need before deciding what to do next.

Authors

M. TrimplE. SkupR. YaremaJ. C. Yun

Institutions

No institution affiliation has been imported for this paper yet.

Add specific reaction

Move through the context

Research map

Open full explorer

Move through nearby people, institutions, topics and adjacent work without leaving the paper page.

Building this map preview

BZPEER is loading the nearby papers, people, topics and institutions for this page.

Structured reviews

0 review(s)

ContributeLeave structured feedbackUse the review template when you have a concrete strength, concern or method question.Open review form
Log in to review

No structured reviews yet. High-signal critique starts here.

Work discussion

0 comment(s)

DiscussAdd a high-signal commentKeep quick notes, caveats and replication pointers separate from formal reviews.Open comment form
Log in to comment

No discussion yet. The first strong comment sets the tone.