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Paper detail

A high entropy alloy as very low melting point solder for advanced electronic packaging

SnBiInZn based high entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 oC. The wetting angle is about 52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for bio-medical devices.

preprint2020arXivOpen access
Yingxia LiuaLi PuYong YangQuanfeng HeZiqing ZhouChengwen TanXiuchen ZhaoQingshan ZhangK. N. Tu
physics.app-phcond-mat.mtrl-sci
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Yingxia LiuaLi PuYong YangQuanfeng HeZiqing ZhouChengwen TanXiuchen ZhaoQingshan ZhangK. N. Tu

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