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Quanfeng He

Quanfeng He appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

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2 published item(s)

preprint2021arXiv

Liquefaction-induced Plasticity from Entropy-boosted Amorphous Ceramics

Ceramics are easy to break, and very few generic mechanisms are available for improving their mechanical properties, e.g., the 1975-discovered anti-fracture mechanism is strictly limited to zirconia and hafnia. Here we report a general mechanism for achieving high plasticity through liquefaction of ceramics. We further disclose the general material design strategies to achieve this difficult task through entropy-boosted amorphous ceramics (EBACs), enabling fracture-resistant properties that can withstand severe plastic deformation (e.g., over 95%, deformed to a thickness of a few nanometers) while maintaining high hardness and reduced modulus. The findings reported here open a new route to ductile ceramics and many applications.

preprint2020arXiv

A high entropy alloy as very low melting point solder for advanced electronic packaging

SnBiInZn based high entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 oC. The wetting angle is about 52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for bio-medical devices.