Abstract
We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully active sensor/readout chip tiles which can be assembled into large area arrays with good yield and minimal dead area. The ability to connect though the bulk of the device can also provide better electrical performance and lower mass.
Connections
Explore this paper’s authors, topics and related work.
Building this map preview
BZPEER is loading the nearby papers, people, topics and institutions for this page.
Reviews 0
Write a review
No reviews yet.
Discussion 0
Add a comment
No comments yet.