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Thorben Casper
Researcher
PaperCoupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip PackagingAuthorship / preprint / 2018PaperElectrothermal Simulation of Bonding Wire Degradation under Uncertain GeometriesAuthorship / preprint / 2016PaperAutomatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field ModelsAuthorship / preprint / 2016PaperDetermination of Bond Wire Failure Probabilities in Microelectronic PackagesAuthorship / preprint / 2017Paper3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by MeasurementsAuthorship / preprint / 2019