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Thorben Casper

Thorben Casper appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

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Computational Engineering, Finance, and Sciencephysics.app-ph

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Published work

5 published item(s)

preprint2019arXiv

3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements

This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip inductors. To validate the simulation models, prototypes for three designs with air and ferrite cores are manufactured and measured. For air core inductors, high agreement between simulation and measurement is obtained. For ferrite core inductors, accurate models require an exact characterization of the ferrite material. These models enable the prediction of magnetic field influences on underlying integrated circuits.

0 citations0 reviewsNo code linkedOpen access
preprint2018arXiv

Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging

This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat distribution is modeled by an electrothermal coupled problem, which poses numerical challenges due to the presence of different geometric scales. The necessity of very fine grids is relaxed by solving and embedding a 1D sub-problem along the wire into the surrounding 3D geometry. The arising singularities are described using de Rham currents. It is shown that the problem is related to fluid flow in porous 3D media with 1D fractures [C. D'Angelo, SIAM Journal on Numerical Analysis 50.1, pp. 194-215, 2012]. A careful formulation of the 1D-3D coupling condition is essential to obtain a stable scheme that yields a physical solution. Elliptic model problems are used to investigate the numerical errors and the corresponding convergence rates. Additionally, the transient electrothermal simulation of a simplified microelectronic chip package as used in industrial applications is presented.

0 citations0 reviewsNo code linkedOpen access
preprint2017arXiv

Determination of Bond Wire Failure Probabilities in Microelectronic Packages

This work deals with the computation of industry-relevant bond wire failure probabilities in microelectronic packages. Under operating conditions, a package is subject to Joule heating that can lead to electrothermally induced failures. Manufacturing tolerances result, e.g., in uncertain bond wire geometries that often induce very small failure probabilities requiring a high number of Monte Carlo (MC) samples to be computed. Therefore, a hybrid MC sampling scheme that combines the use of an expensive computer model with a cheap surrogate is used. The fraction of surrogate evaluations is maximized using an iterative procedure, yielding accurate results at reduced cost. Moreover, the scheme is non-intrusive, i.e., existing code can be reused. The algorithm is used to compute the failure probability for an example package and the computational savings are assessed by performing a surrogate efficiency study.

0 citations0 reviewsNo code linkedOpen access
preprint2016arXiv

Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models

Starting from a 3D electrothermal field problem discretized by the Finite Integration Technique, the equivalence to a circuit description is shown by exploiting the analogy to the Modified Nodal Analysis approach. Using this analogy, an algorithm for the automatic generation of a monolithic SPICE netlist is presented. Joule losses from the electrical circuit are included as heat sources in the thermal circuit. The thermal simulation yields nodal temperatures that influence the electrical conductivity. Apart from the used field discretization, this approach applies no further simplifications. An example 3D chip package is used to validate the algorithm.

0 citations0 reviewsNo code linkedOpen access
preprint2016arXiv

Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries

In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.

0 citations0 reviewsNo code linkedOpen access