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Vitaliy Fadeyev

Vitaliy Fadeyev contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2022arXiv

The Heavy Photon Search Experiment

The Heavy Photon Search (HPS) experiment is designed to search for a new vector boson $A^\prime$ in the mass range of 20 MeV/$c^2$ to 220 MeV/$c^2$ that kinetically mixes with the Standard Model photon with couplings $ε^2 >10^{-10}$. In addition to the general importance of exploring light, weakly coupled physics that is difficult to probe with high-energy colliders, a prime motivation for this search is the possibility that sub-GeV thermal relics constitute dark matter, a scenario that requires a new comparably light mediator, where models with a hidden $U(1)$ gauge symmetry, a "dark", "hidden sector", or "heavy" photon, are particularly attractive. HPS searches for visible signatures of these heavy photons, taking advantage of their small coupling to electric charge to produce them via a process analogous to bremsstrahlung in a fixed target and detect their subsequent decay to $\mathrm{e}^+ \mathrm{e}^-$ pairs in a compact spectrometer. In addition to searching for $\mathrm{e}^+ \mathrm{e}^-$ resonances atop large QED backgrounds, HPS has the ability to precisely measure decay lengths, resulting in unique sensitivity to dark photons, as well as other long-lived new physics. After completion of the experiment and operation of engineering runs in 2015 and 2016 at the JLab CEBAF, physics runs in 2019 and 2021 have provided datasets that are now being analyzed to search for dark photons and other new phenomena.

preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.