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Tony Tran

Tony Tran contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2026arXiv

XiYOLO: Energy-Aware Object Detection via Iterative Architecture Search and Scaling

Object detection on heterogeneous edge devices must satisfy strict energy, latency, and memory constraints while still providing reliable perception for downstream autonomy. Existing energy-aware NAS methods often target limited deployment settings, while real energy remains difficult to optimize because it is highly device-dependent and costly to measure. We address these challenges with an energy-adaptive framework that combines an energy-aware XiResOFA search space, a two-stage energy estimator, and iterative search to identify a single energy-efficient base architecture. We then apply compound scaling to transform this base design into the XiYOLO family across deployment budgets, enabling interpretable accuracy-energy tradeoffs under sparse hardware measurements. Experiments on PascalVOC, COCO, and real-device deployment show that XiYOLO achieves a stronger energy-accuracy tradeoff than YOLO baselines. On PascalVOC, the medium XiYOLO model reaches 86.15 mAP50 while reducing energy relative to YOLOv12m by 20.6% on GPU and 35.9% on NPU. On COCO, XiYOLO reduces energy relative to YOLOv12 by up to 53.7% on GPU and 51.6% on NPU at the small scale. The proposed two-stage estimator also improves sample efficiency over a joint predictor under few-shot adaptation with only 2-20 target-device samples.

preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.