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Tobias Mueller

Tobias Mueller contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2021arXiv

Multiloop functional renormalization group approach to quantum spin systems

Renormalization group methods are well-established tools for the (numerical) investigation of the low-energy properties of correlated quantum many-body systems, allowing to capture their scale-dependent nature. The functional renormalization group (FRG) allows to continuously evolve a microscopic model action to an effective low-energy action as a function of decreasing energy scales via an exact functional flow equation, which is then approximated by some truncation scheme to facilitate computation. Here, we report on our transcription of a recently developed multiloop truncation approach for electronic FRG calculations to the pseudo-fermion functional renormalization group (pf-FRG) for interacting quantum spin systems. We discuss in detail the conceptual intricacies of the flow equations generated by the multiloop truncation, as well as essential refinements to the integration scheme for the resulting integro-differential equations. To benchmark our approach we analyze antiferromagnetic Heisenberg models on the pyrochlore, simple cubic and face-centered cubic lattice, discussing the convergence of physical observables for higher-loop calculations and comparing with existing results where available. Combined, these methodological refinements systematically improve the pf-FRG approach to one of the numerical tools of choice when exploring frustrated quantum magnetism in higher spatial dimensions.

preprint2009arXiv

Heating rate and spin flip lifetime due to near field noise in layered superconducting atom chips

We theoretically investigate the heating rate and spin flip lifetimes due to near field noise for atoms trapped close to layered superconducting structures. In particular, we compare the case of a gold layer deposited above a superconductor with the case of a bare superconductor. We study a niobium-based and a YBCO-based chip. For both niobium and YBCO chips at a temperature of 4.2 K, we find that the deposition of the gold layer can have a significant impact on the heating rate and spin flip lifetime, as a result of the increase of the near field noise. At a chip temperature of 77 K, this effect is less pronounced for the YBCO chip.