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Researcher profile

Timon Heim

Timon Heim contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
hep-exphysics.ins-det

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Published work

3 published item(s)

preprint2020arXiv

Measured Effectiveness of Deep N-well Substrate Isolation in a 65nm Pixel Readout Chip Prototype

The same charge sensitive preamplifier and discriminator circuit with different isolation strategies has been tested to compare the isolation of both analog and digital circuits from the substrate of a 65nm bulk CMOS process to the isolation of only digital circuits, tying analog ground locally to the substrate. This study will show that the circuit with analog on the substrate and digital in deep N-well has better noise isolation between analog and digital.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

New Method for Silicon Sensor Charge Calibration Using Compton Scattering

In order to cope with increasing lifetime radiation damage expected at collider experiments, silicon sensors are becoming increasingly thin. To achieve adequate detection efficiency, the next generation of detectors may have to operate with thresholds below 1000 electron-hole pairs. The readout chips attached to these sensors should be calibrated to some known external charge, but there is a lack of traditional sources in this charge regime. We present a new method for absolute charge calibration based on Compton scattering. In the past, this method has been used for calibration of scintillators, but to our knowledge never for silicon detectors. Here it has been studied using a 150 micron thick planar silicon sensor on an RD53A readout integrated circuit.

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preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

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