Researcher profile

Stephen P. Stagon

Stephen P. Stagon contributes to research discovery and scholarly infrastructure.

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Published work

4 published item(s)

preprint2014arXiv

Controllable growth of Al nanorods for inexpensive and degradation-resistant surface enhanced Raman spectroscopy

Surface enhanced Raman spectroscopy (SERS) has the capacity of detecting trace amount of biological or chemical matter, even single molecules, through the use of metallic nanostructures such as nanorods. Silver (Ag) and gold (Au) nanorods have led to the impressive enhancement of Raman signals, but they are either expensive, degrade fast over time, or suffer from poor sample repeatability. In contrast, Al is much less expensive, and Al nanorods could potentially be resistant to degradation over time due to the protection from native aluminum-oxide layers. Unfortunately, the controllable growth of Al nanorods has not been reported so far. This Letter reports, for the first time, the controllable growth of Al nanorods using physical vapor deposition (PVD); through the use of oxygen (O) surfactants. The enhancement factor of the Al nanorods in SERS is as high as 1250, and shows nearly no degradation after storage in ambient for 30 days or annealing at 475 K for one day.

preprint2013arXiv

Airtight metallic sealing at room temperature under small mechanical pressure

Here, we report a process of metallic sealing using small well-separated Ag nanorods; the process is at room temperature under a small mechanical pressure of 9.0 MPa, and also in ambient. The metallic seals have an air leak rate of 1.1 x 10-3 cm3atm/m2/day, and mechanical shear strength higher than 8.9 MPa. This leak rate meets the requirement of organic solar cells and organic light emitting diodes [1].

preprint2011arXiv

Anomaly of Film Porosity Dependence on Deposition Rate

This Letter reports an anomaly of film porosity dependence on deposition rate during physical vapor deposition - the porosity increases as deposition rate decreases. Using glancing angle deposition of Cu on SiO2 substrate, the authors show that the Cu film consists of well separated nanorods when the deposition rate is 1 nm/second, and that the Cu films consists of a more uniform (or lower porosity) film when the deposition rate is 6 nm/second; all other deposition conditions remain the same. This anomaly is the result of interplay among substrate non-wetting, density of Cu nuclei on the substrate, and the minimum diameter of nanorods.