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Shan Gu

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Published work

2 published item(s)

preprint2021arXiv

Latent Fingerprint Registration via Matching Densely Sampled Points

Latent fingerprint matching is a very important but unsolved problem. As a key step of fingerprint matching, fingerprint registration has a great impact on the recognition performance. Existing latent fingerprint registration approaches are mainly based on establishing correspondences between minutiae, and hence will certainly fail when there are no sufficient number of extracted minutiae due to small fingerprint area or poor image quality. Minutiae extraction has become the bottleneck of latent fingerprint registration. In this paper, we propose a non-minutia latent fingerprint registration method which estimates the spatial transformation between a pair of fingerprints through a dense fingerprint patch alignment and matching procedure. Given a pair of fingerprints to match, we bypass the minutiae extraction step and take uniformly sampled points as key points. Then the proposed patch alignment and matching algorithm compares all pairs of sampling points and produces their similarities along with alignment parameters. Finally, a set of consistent correspondences are found by spectral clustering. Extensive experiments on NIST27 database and MOLF database show that the proposed method achieves the state-of-the-art registration performance, especially under challenging conditions.

preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.