Source author record

Saipraneeth Gouravaraju

Saipraneeth Gouravaraju appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

ResearcherUnclaimed source record

Catalog footprint

What is connected

2works
3topics
3close collaborators

Actions

Connect this record

Log in to claim

Research graph

See the researcher in context

Open full explorer

Inspect adjacent papers, topics, institutions and collaborators without losing the researcher page.

Building this map preview

BZPEER is loading the nearby papers, people, topics and institutions for this page.

Published work

2 published item(s)

preprint2022arXiv

A Bayesian regularization-backpropagation neural network model for peeling computations

Bayesian regularization-backpropagation neural network (BR-BPNN) model is employed to predict some aspects of the gecko spatula peeling viz. the variation of the maximum normal and tangential pull-off forces and the resultant force angle at detachment with the peeling angle. K-fold cross validation is used to improve the effectiveness of the model. The input data is taken from finite element (FE) peeling results. The neural network is trained with 75% of the FE dataset. The remaining 25% are utilized to predict the peeling behavior. The training performance is evaluated for every change in the number of hidden layer neurons to determine the optimal network structure. The relative error is calculated to draw a clear comparison between predicted and FE results. It is shown that the BR-BPNN model in conjunction with k-fold technique has significant potential to estimate the peeling behavior.

preprint2020arXiv

On the presence of a critical detachment angle in gecko spatula peeling -- A numerical investigation using an adhesive friction model

A continuum-based computational contact model is employed to study coupled adhesion and friction in gecko spatulae. Nonlinear finite element analysis is carried out to simulate spatula peeling from a rigid substrate. It is shown that the "frictional adhesion" behavior, until now only observed from seta to toe levels, is also present at the spatula level. It is shown that for sufficiently small spatula pad thickness, the spatula detaches at a constant angle known as the critical detachment angle irrespective of the peeling and shaft angles. The spatula reaches the same energy states at the jump-off contact point, which directly relates to the invariance of the critical detachment angle. This study also reveals that there is an optimum pad thickness associated with the invariance of the critical detachment angle. It is further observed that the sliding of the spatula pad is essential for the invariance of the critical detachment angle.