Researcher profile

Paul L. McEuen

Paul L. McEuen contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate

Trust snapshot

Quick read

Trust 17 - UnverifiedVerification L1Unclaimed author
4works
0followers
2topics
4close collaborators

Actions

Decide how to stay connected

Follow researcher0

Identity and collaboration

How to connect with this researcher

Claiming links this public author record to a researcher profile and unlocks direct collaboration workflows.

Log in to claim

Direct collaboration

Open a focused conversation when the fit is right

Claim this author entity first to unlock direct invitations.

Research graph

See the researcher in context

Open full explorer

Inspect adjacent work, topics, institutions and collaborators without jumping out to a separate graph page.

Building this graph slice

BZPEER is loading the nearby papers, people, topics and institutions for this page.

Published work

4 published item(s)

preprint2023arXiv

BLAST: A Wafer-scale Transfer Process for Heterogeneous Integration of Optics and Electronics

We present a general transfer method for the heterogeneous integration of different photonic and electronic materials systems and devices onto a single substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process works at wafer scale and offers precision alignment, high yield, varying topographies, and suitability for subsequent lithographic processing. We demonstrate BLAST's capabilities by integrating both GaAs and GaN microLEDs with silicon photovoltaics to fabricate optical wireless integrated circuits that up-convert photons from the red to the blue. We also show that BLAST can be applied to a variety of other devices and substrates, including CMOS electronics, vertical cavity surface emitting lasers (VCSELs), and 2D materials. BLAST further enables the modularization of optoelectronic microsystems, where optical devices fabricated on one material substrate can be lithographically integrated with electronic devices on a different substrate in a scalable process.

preprint2022arXiv

Dissipation-enabled hydrodynamic conductivity in a tunable bandgap semiconductor

Electronic transport in the regime where carrier-carrier collisions are the dominant scattering mechanism has taken on new relevance with the advent of ultraclean two-dimensional materials. Here we present a combined theoretical and experimental study of ambipolar hydrodynamic transport in bilayer graphene demonstrating that the conductivity is given by the sum of two Drude-like terms that describe relative motion between electrons and holes, and the collective motion of the electron-hole plasma. As predicted, the measured conductivity of gapless, charge-neutral bilayer graphene is sample- and temperature-independent over a wide range. Away from neutrality, the electron-hole conductivity collapses to a single curve, and a set of just four fitting parameters provides quantitative agreement between theory and experiment at all densities, temperatures, and gaps measured. This work validates recent theories for dissipation-enabled hydrodynamic conductivity and creates a link between semiconductor physics and the emerging field of viscous electronics.

preprint2020arXiv

Bidirectional Self-Folding with Atomic Layer Deposition Nanofilms for Microscale Origami

Origami design principles are scale invariant and enable direct miniaturization of origami structures provided the sheets used for folding have equal thickness to length ratios. Recently, seminal steps have been taken to fabricate microscale origami using unidirectionally actuated sheets with nanoscale thickness. Here, we extend the full power of origami-inspired fabrication to nanoscale sheets by engineering bidirectional folding with 4 nm thick atomic layer deposition (ALD) SiNx-SiO2 bilayer films. Strain differentials within these bilayers result in bending, producing microscopic radii of curvature. We lithographically pattern these bilayers and localize the bending using rigid panels to fabricate a variety of complex micro-origami devices. Upon release, these devices self-fold according to prescribed patterns. Our approach combines planar semiconductor microfabrication methods with computerized origami design, making it easy to fabricate and deploy such microstructures en masse. These devices represent an important step forward in the fabrication and assembly of deployable micromechanical systems that can interact with and manipulate micro- and nanoscale environments.

preprint2019arXiv

Gate-Tunable Graphene Hall Sensors with High Magnetic Field Sensitivity

Solid-state magnetic field sensors are important to both modern electronics and fundamental materials science. Many types of these sensors maintain high sensitivity only in a limited range of temperature and background magnetic field, but Hall-effect sensors are in principle able to operate over a broad range of these conditions. Here, we fabricate and characterize micrometer-scale graphene Hall sensors demonstrating high magnetic field sensitivity from liquid-helium to room temperature and in background magnetic field up to several Tesla. By tuning the charge carrier density with an electrostatic gate, we optimize the magnetic field sensitivity for different working conditions. From measurements of the Hall coefficient and the Hall voltage noise at 1 kHz, we estimate an optimum magnetic field sensitivity of 80 nT Hz$^{-1/2}$ at 4.2 K, 700 nT Hz$^{-1/2}$ at room temperature, and 3 $μ$T Hz$^{-1/2}$ in 3 T background magnetic field at 4.2 K. Our devices perform competitively with the best existing Hall sensor technologies at room temperature, outperform any Hall sensors reported in the literature at 4.2 K, and demonstrate high sensitivity for the first time in a few Tesla applied magnetic field.