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Naeem Iqbal

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Published work

2 published item(s)

preprint2022arXiv

Near-field radiative heat transfer between hybrid polaritonic structures

Near-field radiative heat transfer between close objects may exceed the far-field blackbody radiation in orders of magnitude when exploiting polaritonic materials. Great efforts have been made to experimentally measure this fundamental stochastic effect but mostly based on simple materials. In this work, we foster an all-optical method to characterize the heat transfer between less explored plasmon-phonon hybrid polaritonic systems made of graphene-SiC heterostructures. A large heat flux about 26 times of the blackbody radiation limit is obtained over a 150-nm vacuum gap, attributed to the couplings of three different surface modes (plasmon, phonon polaritons and frustrated mode). The interaction of polaritonic modes in the hybrid system is also explored to build a switchable thermophotonic device with nearly unity heat flux tunability. This work paves the way for understanding mode-mediated near-field heat transfer and provides a platform for building thermophotonic or thermo-optoelectronic blocks for various applications.

preprint2021arXiv

Passive temperature management based on near-field heat transfer

Thermal or temperature management in modern machines has drawn great attentions in the last decades. The waste heat caused during the machine operation is particularly pernicious for the temperature-dependent electronics and may reduce the apparatus performance and lifetime. To control the operation temperature while maintaining high input powers is often a dilemma. Enormous works have been done for the purpose. Here, a passive temperature management method based on near-field heat transfer is introduced, utilizing graphene-plasmon enhanced evanescence wave tunneling. Within a pump power tolerance range of 0.5-7 KW m-2, the device can automatically regulate its thermal emissivity to quickly acquire thermal homeostasis around a designed temperature. It is compact, fully passive and could be incorporated into chip design. The results pave a promising way for passive thermal management that could be used in modern instruments in particular for vacuum environmental applications.