Source author record

Martin Rudolph

Martin Rudolph appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

ResearcherUnclaimed source record

Catalog footprint

What is connected

3works
4topics
4close collaborators

Actions

Connect this record

Log in to claim

Research graph

See the researcher in context

Open full explorer

Inspect adjacent papers, topics, institutions and collaborators without losing the researcher page.

Building this map preview

BZPEER is loading the nearby papers, people, topics and institutions for this page.

Published work

3 published item(s)

preprint2021arXiv

A silicon singlet-triplet qubit driven by spin-valley coupling

Spin-orbit effects, inherent to electrons confined in quantum dots at a silicon heterointerface, provide a means to control electron spin qubits without the added complexity of on-chip, nanofabricated micromagnets or nearby coplanar striplines. Here, we demonstrate a novel singlet-triplet qubit operating mode that can drive qubit evolution at frequencies in excess of 200 MHz. This approach offers a means to electrically turn on and off fast control, while providing high logic gate orthogonality and long qubit dephasing times. We utilize this operational mode for dynamical decoupling experiments to probe the charge noise power spectrum in a silicon metal-oxide-semiconductor double quantum dot. In addition, we assess qubit frequency drift over longer timescales to capture low-frequency noise. We present the charge noise power spectral density up to 3 MHz, which exhibits a $1/f^α$ dependence consistent with $α\sim 0.7$, over 9 orders of magnitude in noise frequency.

preprint2014arXiv

Experimental determination and modelling of volume shrinkage in curing thermosets

This work deals with the characterisation and modelling of the curing process and its associated volume changes of an epoxy based thermoset resin. Measurements from differential scanning calorimetry (DSC) define the progress of the chemical reaction. The related thermochemical volume changes are recorded by an especially constructed experimental setup based on Archimedes principle. Information on measuring procedure and data processing are provided. This includes investigations on compensation of environmental influences, long-term stability and resolution. With the aim of simulating the adhesives curing process, constitutive models representing the reaction kinetics and thermochemical volume changes are presented and the model parameters are identified.

preprint2014arXiv

Modelling and simulation of adhesive curing processes in bonded piezo metal composites

This work deals with the modelling and simulation of curing phenomena in adhesively bonded piezo metal composites which consist of an adhesive layer with integrated piezoelectric module and two surrounding metal sheet layers. In a first step, a general modelling framework is proposed which is able to represent curing phenomena in polymers at finite strains. Based on this formulation, a concretized model is deduced for the simulation of curing in one specific epoxy based adhesive. Here, appropriate material functions are specified and the thermodynamic consistency is proved. Regarding the finite element implementation, a numerical integration scheme and a new approach for the consideration of different initial conditions are provided. Finally, finite element simulations of a newly proposed manufacturing process for the production of bonded piezo metal composite structures are conducted. A deep drawing process of the composite with uncured adhesive layer and the subsequent adhesive curing are investigated.