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Junyi Zhai

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cond-mat.mtrl-sci math.OC

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preprint2022arXiv

Distributed Optimal Power Flow for VSC-MTDC Meshed AC/DC Grids Using ALADIN

The increasing application of voltage source converter (VSC) high voltage direct current (VSC-HVDC) technology in power grids has raised the importance of incorporating DC grids and converters into the existing transmission network. This poses significant challenges in dealing with the resulting optimal power flow (OPF) problem. In this paper, a recently proposed nonconvex distributed optimization algorithm -- Augmented Lagrangian based Alternating Direction Inexact Newton method (ALADIN), is tailored to solve the nonconvex AC/DC OPF problem for emerging voltage source converter (VSC) based multiterminal high voltage direct current (VSC-MTDC) meshed AC/DC hybrid systems. The proposed scheme decomposes this AC/DC hybrid OPF problem and handles it in a fully distributed way. Compared to the existing state-of-art Alternating Direction Method of Multipliers(ADMM), which is in general, not applicable for nonconvex problems, ALADIN has a theoretical convergence guarantee. Applying these two approaches to (VSC-MTDC) coupled with an IEEE benchmark AC power system illustrates that the tailored ALADIN outperforms ADMM in convergence speed and numerical robustness.

preprint2015arXiv

The thermal and electrical properties of the promising semiconductor MXene Hf2CO2

In this work, we investigate the thermal and electrical properties of oxygen-functionalized M2CO2 (M = Ti, Zr, Hf) MXenes using first-principles calculations. Hf2CO2 is found to exhibit a thermal conductivity better than MoS2 and phosphorene. The room temperature thermal conductivity along the armchair direction is determined to be 86.25-131.2 Wm-1K-1 with a flake length of 5-100 um, and the corresponding value in the zigzag direction is approximately 42% of that in the armchair direction. Other important thermal properties of M2CO2 are also considered, including their specific heat and thermal expansion coefficients. The theoretical room temperature thermal expansion coefficient of Hf2CO2 is 6.094x10-6 K-1, which is lower than that of most metals. Moreover, Hf2CO2 is determined to be a semiconductor with a band gap of 1.657 eV and to have high and anisotropic carrier mobility. At room temperature, the Hf2CO2 hole mobility in the armchair direction (in the zigzag direction) is determined to be as high as 13.5x103 cm2V-1s-1 (17.6x103 cm2V-1s-1), which is comparable to that of phosphorene. Broader utilization of Hf2CO2 as a material for nanoelectronics is likely because of its moderate band gap, satisfactory thermal conductivity, low thermal expansion coefficient, and excellent carrier mobility. The corresponding thermal and electrical properties of Ti2CO2 and Zr2CO2 are also provided here for comparison. Notably, Ti2CO2 presents relatively low thermal conductivity and much higher carrier mobility than Hf2CO2, which is an indication that Ti2CO2 may be used as an efficient thermoelectric material.