Researcher profile

John D. Teufel

John D. Teufel contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate

Trust snapshot

Quick read

Trust 15 - UnverifiedVerification L1Unclaimed author
3works
0followers
5topics
4close collaborators

Actions

Decide how to stay connected

Follow researcher0

Identity and collaboration

How to connect with this researcher

Claiming links this public author record to a researcher profile and unlocks direct collaboration workflows.

Log in to claim

Direct collaboration

Open a focused conversation when the fit is right

Claim this author entity first to unlock direct invitations.

Research graph

See the researcher in context

Open full explorer

Inspect adjacent work, topics, institutions and collaborators without jumping out to a separate graph page.

Building this graph slice

BZPEER is loading the nearby papers, people, topics and institutions for this page.

Published work

3 published item(s)

preprint2022arXiv

Dispersive readout of a high-Q encapsulated micromechanical resonator

Encapsulated bulk mode microresonators in the megahertz range are used in commercial timekeeping and sensing applications but their performance is limited by the current state of the art of readout methods. We demonstrate a readout using dispersive coupling between a high-Q encapsulated bulk mode micromechanical resonator and a lumped element microwave resonator that is implemented with commercially available components and standard printed circuit board fabrication methods and operates at room temperature and pressure. A frequency domain measurement of the microwave readout system yields a displacement resolution of $522 \, \mathrm{fm/\sqrt{Hz}}$, which demonstrates an improvement over the state of the art of displacement measurement in bulk-mode encapsulated microresonators. This approach can be readily implemented in cryogenic measurements, allowing for future work characterizing the thermomechanical noise of encapsulated bulk mode resonators at cryogenic temperatures.

preprint2022arXiv

Large Single-Phonon Optomechanical Coupling between Quantum Dots and Tightly Confined Surface Acoustic Waves in the Quantum Regime

Surface acoustic waves (SAWs) coupled to quantum dots (QDs), trapped atoms and ions, and point defects have been proposed as quantum transduction platforms, yet the requisite coupling rates and cavity lifetimes have not been experimentally established. Although the interaction mechanism varies, small acoustic cavities with large zero-point motion are required for high efficiencies. We experimentally establish the feasibility of this platform through electro- and opto-mechanical characterization of tightly focusing, single-mode Gaussian SAW cavities at $\sim$3.6 GHz on GaAs. We explore the performance limits of the platform by fabricating SAW cavities with mode volumes approaching 6$λ^3$ and linewidths $\leq$1 MHz. Employing strain-coupled single InAs QDs as optomechanical intermediaries, we measure single-phonon optomechanical coupling rates $g_0 \approx 2π\times 1.2$ MHz. Sideband scattering rates thus exceed intrinsic phonon loss, indicating the potential for quantum optical readout and transduction of cavity phonon states. To demonstrate the feasibility of this platform for low-noise ground-state quantum transduction, we develop a fiber-based confocal microscope in a dilution refrigerator and perform single-QD resonance fluorescence sideband spectroscopy at mK temperatures. These measurements show conversion between microwave phonons and optical photons with sub-natural linewidths.

preprint2010arXiv

Low-loss superconducting resonant circuits using vacuum-gap-based microwave components

We have produced high-quality complex microwave circuits, such as multiplexed resonators and superconducting phase qubits, using a &#34;vacuum-gap&#34; technology that eliminates lossy dielectric materials. We have improved our design and fabrication strategy beyond our earlier work, leading to increased yield, enabling the realization of these complex circuits. We incorporate both novel vacuum-gap wiring crossovers (VGX) for gradiometric inductors and vacuum-gap capacitors(VGC) on chip to produce resonant circuits that have large internal quality factors (30,000<Q<165,000) at 50 mK, outperforming most dielectric-filled devices. Resonators with VGCs as large as 180 pF confirm single mode behavior of our lumped-element components.