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Jiahui Duan

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Published work

4 published item(s)

preprint2025arXiv

Single-Cell Universal Logic-in-Memory Using 2T-nC FeRAM: An Area and Energy-Efficient Approach for Bulk Bitwise Computation

This work presents a novel approach to configure 2T-nC ferroelectric RAM (FeRAM) for performing single cell logic-in-memory operations, highlighting its advantages in energy-efficient computation over conventional DRAM-based approaches. Unlike conventional 1T-1C dynamic RAM (DRAM), which incurs refresh overhead, 2T-nC FeRAM offers a promising alternative as a non-volatile memory solution with low energy consumption. Our key findings include the potential of quasi-nondestructive readout (QNRO) sensing in 2T-nC FeRAM for logic-in-memory (LiM) applications, demonstrating its inherent capability to perform inverting logic without requiring external modifications, a feature absent in traditional 1T-1C DRAM. We successfully implement the MINORITY function within a single cell of 2T-nC FeRAM, enabling universal NAND and NOR logic, validated through SPICE simulations and experimental data. Additionally, the research investigates the feasibility of 3D integration with 2T-nC FeRAM, showing substantial improvements in storage and computational density, facilitating bulk-bitwise computation. Our evaluation of eight real-world, data-intensive applications reveals that 2T-nC FeRAM achieves 2x higher performance and 2.5x lower energy consumption compared to DRAM. Furthermore, the thermal stability of stacked 2T-nC FeRAM is validated, confirming its reliable operation when integrated on a compute die. These findings emphasize the advantages of 2T-nC FeRAM for LiM, offering superior performance and energy efficiency over conventional DRAM.

preprint2022arXiv

A Data-Driven Column Generation Algorithm For Bin Packing Problem in Manufacturing Industry

The bin packing problem exists widely in real logistic scenarios (e.g., packing pipeline, express delivery), with its goal to improve the packing efficiency and reduce the transportation cost. In this NP-hard combinatorial optimization problem, the position and quantity of each item in the box are strictly restricted by complex constraints and special customer requirements. Existing approaches are hard to obtain the optimal solution since rigorous constraints cannot be handled within a reasonable computation load. In this paper, for handling this difficulty, the packing knowledge is extracted from historical data collected from the packing pipeline of Huawei. First, by fully exploiting the relationship between historical packing records and input orders(orders to be packed) , the problem is reformulated as a set cover problem. Then, two novel strategies, the constraint handling and process acceleration strategies are applied to the classic column generation approach to solve this set cover problem. The cost of solving pricing problem for generating new columns is high due to the complex constraints and customer requirements. The proposed constraints handling strategy exploits the historical packing records with the most negative value of the reduced cost. Those constraints have been implicitly satisfied in these historical packing records so that there is no need to conduct further evaluation on constraints, thus the computational load is saved. To further eliminate the iteration process of column generation algorithm and accelerate the optimization process, a Learning to Price approach called Modified Pointer Network is proposed, by which we can determine which historical packing records should be selected directly. Through experiments on realworld datasets, we show our proposed method can improve the packing success rate and decrease the computation time simultaneously.

preprint2021arXiv

Experimental Extraction and Simulation of Charge Trapping during Endurance of FeFET with TiN/HfZrO/SiO2/Si (MFIS) Gate Structure

We investigate the charge trapping during endurance fatigue of FeFET with TiN/Hf0.5Zr0.5O2/SiO2/Si (MFIS) gate structure. We propose a method of experimentally extracting the number of trapped charges during the memory operation, by measuring the charges in the metal gate and Si substrate. We verify that the amount of trapped charges increases during the endurance fatigue process. This is the first time that the trapped charges are directly experimentally extracted and verified to increase during endurance fatigue. Moreover, we model the interplay between the trapped charges and ferroelectric polarization switching during endurance fatigue. Through the consistency of experimental results and simulated data, we demonstrate that as the memory window decreases: 1) The ferroelectric characteristic of Hf0.5Zr0.5O2 is not degraded. 2) The trap density in the upper bandgap of the gate stacks increases. 3) The reason for memory window decrease is increased trapped electrons after program operation but not related to hole trapping/de-trapping. Our work is helpful to study the charge trapping behavior of FeFET and the related endurance fatigue process.

preprint2021arXiv

Impact of Interlayer and Ferroelectric Materials on Charge Trapping during Endurance Fatigue of FeFET with TiN/HfxZr1-xO2/interlayer/Si (MFIS) Gate Structure

We study the impact of different interlayers and ferroelectric materials on charge trapping during the endurance fatigue of Si FeFET with TiN/HfxZr1-xO2/interlayer/Si (MFIS) gate stack. We have fabricated FeFET devices with different interlayers (SiO2 or SiON) and HfxZr1-xO2 materials (x=0.75, 0.6, 0.5), and directly extracted the charge trapping during endurance fatigue. We find that: 1) The introduction of the N element in the interlayer suppresses charge trapping and defect generation, and improves the endurance characteristics. 2) As the spontaneous polarization (Ps) of the HfxZr1-xO2 decreases from 25.9 μC/cm2 (Hf0.5Zr0.5O2) to 20.3 μC/cm2 (Hf0.6Zr0.4O2), the charge trapping behavior decreases, resulting in the slow degradation rate of memory window (MW) during program/erase cycling; in addition, when the Ps further decreases to 8.1 μC/cm2 (Hf0.75Zr0.25O2), the initial MW nearly disappears (only ~0.02 V). Thus, the reduction of Ps could improve endurance characteristics. On the contract, it can also reduce the MW. Our work helps design the MFIS gate stack to improve endurance characteristics.