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Jan-Hendrik Arling

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hep-ex physics.ins-det

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preprint2026arXiv

Impact of Cold Noise on the tracking performance of ATLAS ITk short strip barrel modules using a charged particle beam

The inner tracking system of the ATLAS experiment will be upgraded to a full silicon detector in 2030 for HL-LHC. The new tracking system is called ITk, the Inner Tracker. It is required to be operable with efficiency higher than 99\% and noise hit occupancy smaller than 0.1\%. During the pre-production phase of the ITk project, many short-strip modules were observed to exhibit so-called "Cold Noise (CN)", wherein clusters of strips displayed very high noise when the modules were operated at temperatures below~$-35\degree$C. To investigate the CN impact and ensure the quality of module production, huge amount of effort have been put in by the collaboration. This paper focuses on the impact of CN on the tracking performance by examining two short strip modules that exhibit CN: one is non-irradiated, while the other one has been irradiated to the maximum expected end-of-lifetime fluence. For each module, the global and single strip tracking performance are evaluated.

preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.