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Researcher profile

Ingrid-Maria Gregor

Ingrid-Maria Gregor contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
physics.ins-dethep-ex

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3 published item(s)

preprint2026arXiv

Characterization of the H2M Monolithic CMOS Sensor

The H2M (Hybrid-to-Monolithic) is a monolithic pixel sensor manufactured in a modified \SI{65}{\nano\meter}~CMOS imaging process with a small collection electrode. Its design addresses the challenges of porting an existing hybrid pixel detector architecture into a monolithic chip, using a digital-on-top design methodology, and developing a compact digital cell library. Each square pixel integrates an analog front-end and digital pulse processing with an 8-bit counter within a \SI{35}{\micro\meter}~pitch. This contribution presents the performance of H2M based on laboratory and test beam measurements, including a comparison with analog front-end simulations in terms of gain and noise. A particular emphasis is placed on backside thinning in order to reduce material budget, down to a total chip thickness of \SI{21}{\micro\meter} for which no degradation in MIP detection performance is observed. For all investigated samples, a MIP detection efficiency above \SI{99}{\%} is achieved below a threshold of approximately 205 electrons. At this threshold, the fake-hit rate corresponds to a matrix occupancy of fewer than one pixel per the \SI{500}{\nano\second}~frame. Measurements reveal a non-uniform in-pixel response, attributed to the formation of local potential wells in regions with low electric field. A simulation flow combining technology computer-aided design, Monte Carlo, and circuit simulations is used to investigate and describe this behavior, and is applied to develop mitigation strategies for future chip submissions with similar features.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

The Tangerine project: Development of high-resolution 65 nm silicon MAPS

The Tangerine project aims to develop new state-of-the-art high-precision silicon detectors. Part of the project has the goal of developing a monolithic active pixel sensor using a novel 65 nm CMOS imaging process, with a small collection electrode. This is the first application of this process in particle physics, and it is of great interest as it allows for an increased logic density and reduced power consumption and material budget compared to other processes. The process is envisioned to be used in for example the next ALICE inner tracker upgrade, and in experiments at the electron-ion collider. The initial goal of the three-year Tangerine project is to develop and test a sensor in a 65 nm CMOS imaging process that can be used in test beam telescopes at DESY, providing excellent spatial resolution and high time resolution, and thus demonstrating the capabilities of the process. The project covers all aspects of sensor R&D, from electronics and sensor design using simulations, to prototype test chip characterisation in labs and at test beams. The sensor design simulations are performed by using a powerful combination of detailed electric field simulations using technology computer-aided design and high-statistics Monte Carlo simulations using the Allpix Squared framework. A first prototype test chip in the process has been designed and produced, and successfully operated and tested both in labs and at test beams.

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preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

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