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Researcher profile

Haocong Luo

Haocong Luo contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
Hardware ArchitectureCryptography and Security

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Published work

3 published item(s)

preprint2022arXiv

A Case for Transparent Reliability in DRAM Systems

Today's systems have diverse needs that are difficult to address using one-size-fits-all commodity DRAM. Unfortunately, although system designers can theoretically adapt commodity DRAM chips to meet their particular design goals (e.g., by reducing access timings to improve performance, implementing system-level RowHammer mitigations), we observe that designers today lack sufficient insight into commodity DRAM chips' reliability characteristics to implement these techniques in practice. In this work, we make a case for DRAM manufacturers to provide increased transparency into key aspects of DRAM reliability (e.g., basic chip design properties, testing strategies). Doing so enables system designers to make informed decisions to better adapt commodity DRAM to meet modern systems' needs while preserving its cost advantages. To support our argument, we study four ways that system designers can adapt commodity DRAM chips to system-specific design goals: (1) improving DRAM reliability; (2) reducing DRAM refresh overheads; (3) reducing DRAM access latency; and (4) mitigating RowHammer attacks. We observe that adopting solutions for any of the four goals requires system designers to make assumptions about a DRAM chip's reliability characteristics. These assumptions discourage system designers from using such solutions in practice due to the difficulty of both making and relying upon the assumption. We identify DRAM standards as the root of the problem: current standards rigidly enforce a fixed operating point with no specifications for how a system designer might explore alternative operating points. To overcome this problem, we introduce a two-step approach that reevaluates DRAM standards with a focus on transparency of DRAM reliability so that system designers are encouraged to make the most of commodity DRAM technology for both current and future DRAM chips.

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preprint2022arXiv

Understanding RowHammer Under Reduced Wordline Voltage: An Experimental Study Using Real DRAM Devices

RowHammer is a circuit-level DRAM vulnerability, where repeatedly activating and precharging a DRAM row, and thus alternating the voltage of a row's wordline between low and high voltage levels, can cause bit flips in physically nearby rows. Recent DRAM chips are more vulnerable to RowHammer: with technology node scaling, the minimum number of activate-precharge cycles to induce a RowHammer bit flip reduces and the RowHammer bit error rate increases. Therefore, it is critical to develop effective and scalable approaches to protect modern DRAM systems against RowHammer. To enable such solutions, it is essential to develop a deeper understanding of the RowHammer vulnerability of modern DRAM chips. However, even though the voltage toggling on a wordline is a key determinant of RowHammer vulnerability, no prior work experimentally demonstrates the effect of wordline voltage (VPP) on the RowHammer vulnerability. Our work closes this gap in understanding. This is the first work to experimentally demonstrate on 272 real DRAM chips that lowering VPP reduces a DRAM chip's RowHammer vulnerability. We show that lowering VPP 1) increases the number of activate-precharge cycles needed to induce a RowHammer bit flip by up to 85.8% with an average of 7.4% across all tested chips and 2) decreases the RowHammer bit error rate by up to 66.9% with an average of 15.2% across all tested chips. At the same time, reducing VPP marginally worsens a DRAM cell's access latency, charge restoration, and data retention time within the guardbands of system-level nominal timing parameters for 208 out of 272 tested chips. We conclude that reducing VPP is a promising strategy for reducing a DRAM chip's RowHammer vulnerability without requiring modifications to DRAM chips.

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preprint2020arXiv

CLR-DRAM: A Low-Cost DRAM Architecture Enabling Dynamic Capacity-Latency Trade-Off

DRAM is the prevalent main memory technology, but its long access latency can limit the performance of many workloads. Although prior works provide DRAM designs that reduce DRAM access latency, their reduced storage capacities hinder the performance of workloads that need large memory capacity. Because the capacity-latency trade-off is fixed at design time, previous works cannot achieve maximum performance under very different and dynamic workload demands. This paper proposes Capacity-Latency-Reconfigurable DRAM (CLR-DRAM), a new DRAM architecture that enables dynamic capacity-latency trade-off at low cost. CLR-DRAM allows dynamic reconfiguration of any DRAM row to switch between two operating modes: 1) max-capacity mode, where every DRAM cell operates individually to achieve approximately the same storage density as a density-optimized commodity DRAM chip and 2) high-performance mode, where two adjacent DRAM cells in a DRAM row and their sense amplifiers are coupled to operate as a single low-latency logical cell driven by a single logical sense amplifier. We implement CLR-DRAM by adding isolation transistors in each DRAM subarray. Our evaluations show that CLR-DRAM can improve system performance and DRAM energy consumption by 18.6% and 29.7% on average with four-core multiprogrammed workloads. We believe that CLR-DRAM opens new research directions for a system to adapt to the diverse and dynamically changing memory capacity and access latency demands of workloads.

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