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Researcher profile

Gregor Kramberger

Gregor Kramberger contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
hep-exphysics.ins-det

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Published work

2 published item(s)

preprint2023arXiv

Investigation of low gain avalanche detectors exposed to proton fluences beyond 10$^{15}$ n$_\mathrm{eq}$cm$^{-2}$

Low gain avalanche detectors (LGADs) deliver excellent timing resolution, which can mitigate mis-assignment of vertices associated with pileup at the High Luminosity LHC and other future hadron colliders. The most highly irradiated LGADs will be subject to $2.5 \times10^{15} \mathrm{n}_\mathrm{eq} \mathrm{cm}^{-2}$ of hadronic fluence during HL-LHC operation; their performance must tolerate this. Hamamatsu Photonics K.K. and Fondazione Bruno Kessler LGADs have been irradiated with 400 and 500 MeV protons respectively in several steps up to $1.5 \times10^{15} \mathrm{n}_\mathrm{eq} \mathrm{cm}^{-2}$. Measurements of the acceptor removal constants of the gain layers, evolution of the timing resolution and charge collection with damage, and inter-channel isolation characteristics, for a variety of design options, are presented here.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

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