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Geun Ho Ahn

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physics.app-ph physics.optics

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preprint2026arXiv

Single-Chip 1.024 Tb/s Optical Receiver for High-Speed Optical links

Integrated optical transceivers, utilizing wavelength-division-multiplexing, offer a path forward for implementation of compact, high-bandwidth and energy-efficient interconnects for future data centers. Here we report the demonstration of a monolithically integrated optical receiver in 45nm CMOS, where efficient multi-layer optical demultiplexing with capacitive tuning, energy efficient electronics and wideband inverse designed grating couplers enable implementation of a 32-channel receiver chip based on wavelength-division multiplexing. The chip operates at an aggregate data-rate of 1.024 Tb/s with all channels operating simultaneously at a data-rate of 32 Gb/s/channel achieving a record energy efficiency of 71 fJ/b, including the power consumption of both the electronic circuitry and the tuning and control of photonic devices, and a record bandwidth density of 4 Tb/s/mm2. The receiver achieves a bit-error-rate below 1E-12 without requiring equalization, error correction or digital processing. Inverse-designed broadband grating couplers provide efficient, low-loss optical coupling into the chip. An on-chip demultiplexer, composed of Mach-Zehnder interferometers (MZIs) and ring resonators, offers a large channel-to-channel isolation sufficient for error-free operation. Capacitive phase shifters embedded within the ring resonators of the demultiplexer are used for wavelength alignment at a zero static power consumption. MZIs and ring-resonators are periodically selected and autonomously locked to the wavelength of the corresponding optical carrier. The implemented monolithic receiver offers a scalable, energy-efficient and reliable solution for the beyond Tb/s optical interconnects.

preprint2022arXiv

Platform-agnostic waveguide integration of high-speed photodetectors with evaporated tellurium thin films

Many attractive photonics platforms still lack integrated photodetectors due to inherent material incompatibilities and lack of process scalability, preventing their widespread deployment. Here we address the problem of scalably integrating photodetectors in a photonic platform-independent manner. Using a thermal evaporation and deposition technique developed for nanoelectronics, we show that tellurium (Te), a quasi-2D semi-conductive element, can be evaporated at low temperature directly onto photonic chips to form air-stable, high-responsivity, high-speed, ultrawide-band photodetectors. We demonstrate detection at visible, telecom, and mid-infrared wavelengths, a bandwidth of more than 40 GHz, and platform-independent scalable integration with photonic structures in silicon, silicon nitride and lithium niobate.

preprint2020arXiv

Inverse-designed photonics for semiconductor foundries

Silicon photonics is becoming a leading technology in photonics, displacing traditional fiber optic transceivers in long-haul and intra-data-center links and enabling new applications such as solid-state LiDAR (Light Detection and Ranging) and optical machine learning. Further improving the density and performance of silicon photonics, however, has been challenging, due to the large size and limited performance of traditional semi-analytically designed components. Automated optimization of photonic devices using inverse design is a promising path forward but has until now faced difficulties in producing designs that can be fabricated reliably at scale. Here we experimentally demonstrate four inverse-designed devices - a spatial mode multiplexer, wavelength demultiplexer, 50-50 directional coupler, and 3-way power splitter - made successfully in a commercial silicon photonics foundry. These devices are efficient, robust to fabrication variability, and compact, with footprints only a few micrometers across. They pave the way forward for the widespread practical use of inverse design.

preprint2019arXiv

Inverse-designed photonic circuits for fully passive, bias-free Kerr-based nonreciprocal transmission and routing

Nonreciprocal devices such as isolators and circulators are key enabling technologies for communication systems, both at microwave and optical frequencies. While nonreciprocal devices based on magnetic effects are available for free-space and fibre-optic communication systems, their on-chip integration has been challenging, primarily due to the concomitant high insertion loss, weak magneto-optical effects, and material incompatibility. We show that Kerr nonlinear resonators can be used to achieve all-passive, low-loss, bias-free, broadband nonreciprocal transmission and routing for applications in photonic systems such as chip-scale LIDAR. A multi-port nonlinear Fano resonator is used as an on-chip, all-optical router for frequency comb based distance measurement. Since time-reversal symmetry imposes stringent limitations on the operating power range and transmission of a single nonlinear resonator, we implement a cascaded Fano-Lorentzian resonator system that overcomes these limitations and significantly improves the insertion loss, bandwidth and non-reciprocal power range of current state-of-the-art devices. This work provides a platform-independent design for nonreciprocal transmission and routing that are ideally suited for photonic integration.