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Researcher profile

Eric Anderssen

Eric Anderssen contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
physics.ins-dethep-ex

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Published work

2 published item(s)

preprint2022arXiv

Light-weight and highly thermally conductive support structures for future tracking detectors

Detector mechanics can play a significant role in a detector's performance, improvements typically require in-depth study of total mass, novel ways to reduce the total mass, as well as more integrated design concepts to save on material budgets and optimize performance. Particle detectors at future colliders rely on ever more precise charged particle tracking devices, which are supported by structures manufactured from composite materials. This article lays out engineering techniques able to solve challenges related to the design and manufacturing of future support structures. Examples of current efforts at Purdue University related to the high-luminosity upgrade of the CMS detector are provided to demonstrate the prospects of suggested approaches for detectors at new colliders: a future circular collider or a muon collider. Detectors at electron-positron machines have significantly smaller material budgets and require targeted concepts.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

0 citations0 reviewsNo code linkedOpen access