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E. Bussmann

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2 publications

preprint2014arXiv

Imaging and registration of buried atomic-precision donor devices using scanning capacitance microscopy

We show that a scanning capacitance microscope (SCM) can image buried delta-doped donor nanostructures fabricated in Si via a recently developed atomic-precision scanning tunneling microscopy (STM) lithography technique. A critical challenge in completing atomic-precision nanoelectronic devices is to accurately align mesoscopic metal contacts to the STM defined nanostructures. Utilizing the SCMs ability to image buried dopant nanostructures, we have developed a technique by which we are able to position metal electrodes on the surface to form contacts to underlying STM fabricated donor nanostructures with a measured accuracy of 300 nm. Low temperature (T=4K) transport measurements confirm successful placement of the contacts to the donor nanostructures.

preprint2014arXiv

Probing limits of STM field emission patterned Si:P δδ-doped devices

Recently, a single atom transistor was deterministically fabricated using phosphorus in Si by H-desorption lithography with a scanning tunneling microscope (STM). This milestone in precision, achieved by operating the STM in the conventional tunneling mode, typically utilizes very slow (∼ ⁣102 nm2/s\sim\!10^2~\mathrm{nm^2/s}) patterning speeds. By contrast, using the STM in a high voltage (>10 V>10~\mathrm{V}) field emission mode, patterning speeds can be increased by orders of magnitude to ≳ ⁣104 nm2/s\gtrsim\!10^4~\mathrm{nm^2/s}. We show that the rapid patterning negligibly affects the functionality of relatively large micron-sized features, which act as contacting pads on these devices. For nanoscale structures, we show that the resulting transport is consistent with the donor incorporation chemistry enhancing the device definition to a scale of 10 nm10~\mathrm{nm} even though the pattering spot size is 40 nm40~\mathrm{nm}.

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