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Source author record

Dimitrios Tzovaras

Dimitrios Tzovaras appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

ResearcherUnclaimed source record
Computer VisionCryptography and Securityeess.IVMachine LearningNetworking and Internet Architecture

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Published work

4 published item(s)

preprint2020arXiv

A Deep Learning Framework for Simulation and Defect Prediction Applied in Microelectronics

The prediction of upcoming events in industrial processes has been a long-standing research goal since it enables optimization of manufacturing parameters, planning of equipment maintenance and more importantly prediction and eventually prevention of defects. While existing approaches have accomplished substantial progress, they are mostly limited to processing of one dimensional signals or require parameter tuning to model environmental parameters. In this paper, we propose an alternative approach based on deep neural networks that simulates changes in the 3D structure of a monitored object in a batch based on previous 3D measurements. In particular, we propose an architecture based on 3D Convolutional Neural Networks (3DCNN) in order to model the geometric variations in manufacturing parameters and predict upcoming events related to sub-optimal performance. We validate our framework on a microelectronics use-case using the recently published PCB scans dataset where we simulate changes on the shape and volume of glue deposited on an Liquid Crystal Polymer (LCP) substrate before the attachment of integrated circuits (IC). Experimental evaluation examines the impact of different choices in the cost function during training and shows that the proposed method can be efficiently used for defect prediction.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

Fault Diagnosis in Microelectronics Attachment via Deep Learning Analysis of 3D Laser Scans

A common source of defects in manufacturing miniature Printed Circuits Boards (PCB) is the attachment of silicon die or other wire bondable components on a Liquid Crystal Polymer (LCP) substrate. Typically, a conductive glue is dispensed prior to attachment with defects caused either by insufficient or excessive glue. The current practice in electronics industry is to examine the deposited glue by a human operator a process that is both time consuming and inefficient especially in preproduction runs where the error rate is high. In this paper we propose a system that automates fault diagnosis by accurately estimating the volume of glue deposits before and even after die attachment. To this end a modular scanning system is deployed that produces high resolution point clouds whereas the actual estimation of glue volume is performed by (R)egression-Net (RNet), a 3D Convolutional Neural Network (3DCNN). RNet outperforms other deep architectures and is able to estimate the volume either directly from the point cloud of a glue deposit or more interestingly after die attachment when only a small part of glue is visible around each die. The entire methodology is evaluated under operational conditions where the proposed system achieves accurate results without delaying the manufacturing process.

0 citations0 reviewsNo code linkedOpen access
preprint2013arXiv

NEMESYS: Enhanced Network Security for Seamless Service Provisioning in the Smart Mobile Ecosystem

As a consequence of the growing popularity of smart mobile devices, mobile malware is clearly on the rise, with attackers targeting valuable user information and exploiting vulnerabilities of the mobile ecosystems. With the emergence of large-scale mobile botnets, smartphones can also be used to launch attacks on mobile networks. The NEMESYS project will develop novel security technologies for seamless service provisioning in the smart mobile ecosystem, and improve mobile network security through better understanding of the threat landscape. NEMESYS will gather and analyze information about the nature of cyber-attacks targeting mobile users and the mobile network so that appropriate counter-measures can be taken. We will develop a data collection infrastructure that incorporates virtualized mobile honeypots and a honeyclient, to gather, detect and provide early warning of mobile attacks and better understand the modus operandi of cyber-criminals that target mobile devices. By correlating the extracted information with the known patterns of attacks from wireline networks, we will reveal and identify trends in the way that cyber-criminals launch attacks against mobile devices.

0 citations0 reviewsNo code linkedOpen access
preprint2013arXiv

Security for Smart Mobile Networks: The NEMESYS Approach

The growing popularity of smart mobile devices such as smartphones and tablets has made them an attractive target for cyber-criminals, resulting in a rapidly growing and evolving mobile threat as attackers experiment with new business models by targeting mobile users. With the emergence of the first large-scale mobile botnets, the core network has also become vulnerable to distributed denial-of-service attacks such as the signaling attack. Furthermore, complementary access methods such as Wi-Fi and femtocells introduce additional vulnerabilities for the mobile users as well as the core network. In this paper, we present the NEMESYS approach to smart mobile network security. The goal of the NEMESYS project is to develop novel security technologies for seamless service provisioning in the smart mobile ecosystem, and to improve mobile network security through a better understanding of the threat landscape. To this purpose, NEMESYS will collect and analyze information about the nature of cyber-attacks targeting smart mobile devices and the core network so that appropriate counter-measures can be taken. We are developing a data collection infrastructure that incorporates virtualized mobile honeypots and honeyclients in order to gather, detect and provide early warning of mobile attacks and understand the modus operandi of cyber-criminals that target mobile devices. By correlating the extracted information with known attack patterns from wireline networks, we plan to reveal and identify the possible shift in the way that cyber-criminals launch attacks against smart mobile devices.

0 citations0 reviewsNo code linkedOpen access